Chiu Fai Wong

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for ball placement
- Patent number 6,276,598
- Issue date Aug 21, 2001
- ASM Assembly Automation Ltd.
- Chi Wah Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radial wire bonder and selectable side view inspection system
- Patent number 6,109,501
- Issue date Aug 29, 2000
- ASM Assembly Automotion Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radial wire bonder and selectable side view inspection system
- Patent number 5,897,048
- Issue date Apr 27, 1999
- ASM Assembly Automation Ltd.
- Chi Wah Cheng
- H01 - BASIC ELECTRIC ELEMENTS