Chiu-Wen LEE

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including processing element and I/O element
- Patent number 12,107,074
- Issue date Oct 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,967,559
- Issue date Apr 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,518
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including thermal dissipation element...
- Patent number 11,127,650
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,960,136
- Issue date May 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsiang Hsiao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,953,930
- Issue date Apr 24, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,443,813
- Issue date Sep 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsiang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT
- Publication number 20250022848
- Publication date Jan 16, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE
- Publication number 20240345341
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- G02 - OPTICS
Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20240345315
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun-Yen TING
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240332192
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE AND ELECTRONIC DEVICE
- Publication number 20240329300
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-I WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240329344
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE AND METHOD OF TRANSMITTING OPTICAL SIGNAL
- Publication number 20240264368
- Publication date Aug 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Hung-Chun KUO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240250030
- Publication date Jul 25, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND PACKAGE STRUCTURE
- Publication number 20240155758
- Publication date May 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230207524
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230163077
- Publication date May 25, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220392871
- Publication date Dec 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...
- Publication number 20210265231
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210265273
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180114762
- Publication date Apr 26, 2018
- Advanced Semiconductor Engineering, Inc.
- Ying-Ta CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160358875
- Publication date Dec 8, 2016
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsiang HSIAO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160260677
- Publication date Sep 8, 2016
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsiang HSIAO
- H01 - BASIC ELECTRIC ELEMENTS

Chiu-Wen LEE

Person

Patents Grantslast 30 patents

Semiconductor package including processing element and I/O element

Electronic package

Semiconductor package

Semiconductor device package including thermal dissipation element...

Semiconductor device and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT

PACKAGE DEVICE

OPTOELECTRONIC PACKAGE

PACKAGE STRUCTURE

PACKAGE DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC DEVICE AND METHOD OF TRANSMITTING OPTICAL SIGNAL

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME