Chiung-Yueh TIEN

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TAICHUNG CITY, TW

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Patents Grantslast 30 patents

Information Patent Grant
Pressure sensor package
- Patent number 11,041,774
- Issue date Jun 22, 2021
- Lingsen Precision Industries, Ltd.
- Ming-Te Tu
- G01 - MEASURING TESTING
Information Patent Grant
Waterproof MEMS chip package structure
- Patent number 10,696,543
- Issue date Jun 30, 2020
- Lingsen Precision Industries, Ltd.
- Chiung-Yueh Tien
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR PACKAGE
- Publication number 20190265118
- Publication date Aug 29, 2019
- LINGSEN PRECISION INDUSTRIES, LTD.
- Ming-Te TU
- G01 - MEASURING TESTING