Cho-Hsin Chang

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package, supporting structure and fabrication method the...
- Patent number 11,527,472
- Issue date Dec 13, 2022
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package including cutting encap...
- Patent number 10,074,613
- Issue date Sep 11, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure
- Patent number 9,899,335
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having metal layer
- Patent number 9,673,151
- Issue date Jun 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 9,508,656
- Issue date Nov 29, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shielding member and method of manufactu...
- Patent number 9,490,219
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...
- Publication number 20210305148
- Publication date Sep 30, 2021
- Siliconware Precision Industries Co., Ltd.
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING METAL LAYER
- Publication number 20170236787
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PACKAGE STRUCTURE
- Publication number 20170103953
- Publication date Apr 13, 2017
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHOD
- Publication number 20160093576
- Publication date Mar 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20160027740
- Publication date Jan 28, 2016
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150333017
- Publication date Nov 19, 2015
- Cho-Hsin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120235259
- Publication date Sep 20, 2012
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Hao-Ju Fang
- H01 - BASIC ELECTRIC ELEMENTS

Cho-Hsin Chang

Person

Patents Grantslast 30 patents

Electronic package, supporting structure and fabrication method the...

Method of fabricating semiconductor package including cutting encap...

Method for fabricating package structure

Semiconductor package having metal layer

Package structure and method for fabricating the same

Semiconductor package with shielding member and method of manufactu...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE, SUPPORTING STRUCTURE AND FABRICATION METHOD THE...

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING METAL LAYER

METHOD FOR FABRICATING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND RELATED METHOD

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME