Chok W. Ho

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Etching processes used in MEMS production
- Patent number 8,308,962
- Issue date Nov 13, 2012
- QUALCOMM MEMS Technologies, Inc.
- Philip Floyd
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Use of ammonia for etching organic low-k dielectrics
- Patent number 7,105,454
- Issue date Sep 12, 2006
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of ammonia for etching organic low-k dielectrics
- Patent number 6,893,969
- Issue date May 17, 2005
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-etch photoresist strip with O2 and NH3 for organosilicate glas...
- Patent number 6,777,344
- Issue date Aug 17, 2004
- Lam Research Corporation
- Rao V. Annapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of hydrocarbon addition for the elimination of micromasking dur...
- Patent number 6,620,733
- Issue date Sep 16, 2003
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high oxide to photoresist selective etch of high-aspect-ratio...
- Patent number 6,486,070
- Issue date Nov 26, 2002
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)
- Publication number 20180254239
- Publication date Sep 6, 2018
- GLOBALFOUNDRIES INC.
- Vijay SUKUMARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL SPACERS ALONG CONDUCTIVE LINES
- Publication number 20130113810
- Publication date May 9, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Chok Wah Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCHING PROCESSES USED IN MEMS PRODUCTION
- Publication number 20090071932
- Publication date Mar 19, 2009
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Philip Floyd
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ETCHING PROCESSES USED IN MEMS PRODUCTION
- Publication number 20090071933
- Publication date Mar 19, 2009
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Philip Floyd
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Use of ammonia for etching organic low-k dielectrics
- Publication number 20050003676
- Publication date Jan 6, 2005
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of hydrocarbon addition for the elimination of micromasking dur...
- Publication number 20020110992
- Publication date Aug 15, 2002
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-etch photoresist strip with O2 and NH3 for organosilicate glas...
- Publication number 20020111041
- Publication date Aug 15, 2002
- Lam Research Corporation
- Rao V. Annapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of ammonia for etching organic low-k dielectrics
- Publication number 20020108929
- Publication date Aug 15, 2002
- Lam Research Corporation
- Chok W. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Etching processes used in MEMS production

Use of ammonia for etching organic low-k dielectrics

Use of ammonia for etching organic low-k dielectrics

Post-etch photoresist strip with O2 and NH3 for organosilicate glas...

Use of hydrocarbon addition for the elimination of micromasking dur...

Ultra-high oxide to photoresist selective etch of high-aspect-ratio...

Patents Applicationslast 30 patents

FORMING METAL CAP LAYER OVER THROUGH-GLASS-VIAS (TGVs)

SIDEWALL SPACERS ALONG CONDUCTIVE LINES

ETCHING PROCESSES USED IN MEMS PRODUCTION

ETCHING PROCESSES USED IN MEMS PRODUCTION

Use of ammonia for etching organic low-k dielectrics

Use of hydrocarbon addition for the elimination of micromasking dur...

Post-etch photoresist strip with O2 and NH3 for organosilicate glas...

Use of ammonia for etching organic low-k dielectrics