Chon Cheong Lei

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for selective thermal paste deposition and ret...
- Patent number 6,965,171
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Tim H. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow type electrical apparatus packaging having integrated...
- Patent number 6,910,615
- Issue date Jun 28, 2005
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-aqueous solvent based method of cleaning rosin flux residue
- Patent number 6,800,141
- Issue date Oct 5, 2004
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semi-aqueous solvent cleaning of paste processing residue from subs...
- Patent number 6,742,530
- Issue date Jun 1, 2004
- International Business Machines Corporation
- Krishna G. Sachdev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying solder to an element on a substrate
- Patent number 6,708,872
- Issue date Mar 23, 2004
- International Business Machines Corporation
- Peter Alfred Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of removing silicone polymer deposits from electronic compon...
- Patent number 6,652,665
- Issue date Nov 25, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Semi-aqueous solvent cleaning of paste processing residue from subs...
- Patent number 6,569,252
- Issue date May 27, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning method to remove flux residue in electronic assembly
- Patent number 6,503,874
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Assembly of multi-chip modules using eutectic solders
- Patent number 6,491,205
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Chon C. Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying solder to an element on a substrate
- Patent number 6,425,518
- Issue date Jul 30, 2002
- International Business Machines Corporation
- Peter Alfred Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature solder column attach by injection molded solder and...
- Patent number 6,276,596
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic solder array using injection molded solder
- Patent number 6,153,505
- Issue date Nov 28, 2000
- International Business Machines Corporation
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic solder array using injection molded solder
- Patent number 6,029,882
- Issue date Feb 29, 2000
- International Business Machines Corporation
- Lannie R. Bolde
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive low melt test for off-composition solder
- Patent number 6,016,947
- Issue date Jan 25, 2000
- International Business Machines Corporation
- Timothy W. Donahue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of removing flux residue from microelectronic components
- Patent number 5,938,856
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Fixture and method for securing electronic modules during wet proce...
- Patent number 5,913,985
- Issue date Jun 22, 1999
- International Business Machines Corporation
- Chon Cheong Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE FOR SELECTIVE THERMAL PASTE DEPOSITION AND RET...
- Publication number 20050269716
- Publication date Dec 8, 2005
- International Business Machines Corporation
- Tim H. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder reflow type electrical apparatus packaging having integrated...
- Publication number 20040188497
- Publication date Sep 30, 2004
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-aqueous solvent based method of cleaning rosin flux residue
- Publication number 20030121529
- Publication date Jul 3, 2003
- Krishna G. Sachdev
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semi-aqueous solvent cleaning of paste processing residue from subs...
- Publication number 20030066540
- Publication date Apr 10, 2003
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method and apparatus for applying solder to an element on a substrate
- Publication number 20030024968
- Publication date Feb 6, 2003
- International Business Machines Corporation
- Peter Alfred Gruber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cleaning method to remove flux residue in electronic assembly
- Publication number 20020094940
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Krishna G. Sachdev
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Low temperature solder column attach by injection molded solder and...
- Publication number 20020023945
- Publication date Feb 28, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF CURED SILICONE ADHESIVE FOR REWORKING ELECTRONIC COMPONENTS
- Publication number 20020000239
- Publication date Jan 3, 2002
- KRISHNA G. SACHDEV
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Chon Cheong Lei

Person

Patents Grantslast 30 patents

Method and structure for selective thermal paste deposition and ret...

Solder reflow type electrical apparatus packaging having integrated...

Semi-aqueous solvent based method of cleaning rosin flux residue

Semi-aqueous solvent cleaning of paste processing residue from subs...

Method and apparatus for applying solder to an element on a substrate

Method of removing silicone polymer deposits from electronic compon...

Semi-aqueous solvent cleaning of paste processing residue from subs...

Cleaning method to remove flux residue in electronic assembly

Assembly of multi-chip modules using eutectic solders

Method and apparatus for applying solder to an element on a substrate

Low temperature solder column attach by injection molded solder and...

Plastic solder array using injection molded solder

Plastic solder array using injection molded solder

Non-destructive low melt test for off-composition solder

Process of removing flux residue from microelectronic components

Fixture and method for securing electronic modules during wet proce...

Patents Applicationslast 30 patents

METHOD AND STRUCTURE FOR SELECTIVE THERMAL PASTE DEPOSITION AND RET...

Solder reflow type electrical apparatus packaging having integrated...

Semi-aqueous solvent based method of cleaning rosin flux residue

Semi-aqueous solvent cleaning of paste processing residue from subs...

Method and apparatus for applying solder to an element on a substrate

Cleaning method to remove flux residue in electronic assembly

Low temperature solder column attach by injection molded solder and...

REMOVAL OF CURED SILICONE ADHESIVE FOR REWORKING ELECTRONIC COMPONENTS