Chong Chin Hui

Person

Braddel View, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices with tiered decks of differing pillar densi...
- Patent number 11,563,027
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Md Zakir Ullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 9,673,121
- Issue date Jun 6, 2017
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution elements and semiconductor device packages including...
- Patent number 8,749,050
- Issue date Jun 10, 2014
- Micron Technology, Inc.
- Choon Kuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer structure with embedded capacitor structure, and methods...
- Patent number 8,653,625
- Issue date Feb 18, 2014
- MicronTechnology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor device packages including a semico...
- Patent number 8,486,825
- Issue date Jul 16, 2013
- Micron Technology, Inc.
- Choon Kuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packages including a semiconductor device and...
- Patent number 8,288,859
- Issue date Oct 16, 2012
- Micron Technology, Inc.
- Choon Kuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 8,269,328
- Issue date Sep 18, 2012
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and assemblies
- Patent number 8,125,092
- Issue date Feb 28, 2012
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,846,768
- Issue date Dec 7, 2010
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC device comprising an embedded flex circuit on leadframe...
- Patent number 7,816,778
- Issue date Oct 19, 2010
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up-package for integrated circuit devices, and methods of mak...
- Patent number 7,691,682
- Issue date Apr 6, 2010
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrierless chip package for integrated circuit devices, and method...
- Patent number 7,504,285
- Issue date Mar 17, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die package for peripheral and center device pad layout device
- Patent number 7,425,463
- Issue date Sep 16, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device package for peripheral and center device pad layout...
- Patent number 7,205,656
- Issue date Apr 17, 2007
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package with multi layered l...
- Patent number 6,972,214
- Issue date Dec 6, 2005
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor component with multi layered l...
- Patent number 6,835,599
- Issue date Dec 28, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having multi layered leadframe
- Patent number 6,784,525
- Issue date Aug 31, 2004
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for encapsulating intermediate conductive elements connectin...
- Patent number 6,781,248
- Issue date Aug 24, 2004
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating BOC semiconductor package
- Patent number 6,638,792
- Issue date Oct 28, 2003
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BOC semiconductor package including a semiconductor die and a subst...
- Patent number 6,507,114
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATES WITH DOWNSET
- Publication number 20240282751
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Ling Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH TIERED DECKS OF ALIGNED PILLARS EXHIBI...
- Publication number 20230165004
- Publication date May 25, 2023
- Micron Technology, Inc.
- Md Zakir Ullah
Information Patent Application
MICROELECTRONIC DEVICES WITH TIERED DECKS OF DIFFERING PILLAR DENSI...
- Publication number 20220077177
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Md Zakir Ullah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...
- Publication number 20130292810
- Publication date Nov 7, 2013
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICO...
- Publication number 20130059419
- Publication date Mar 7, 2013
- Micron Technology, Inc.
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20110266701
- Publication date Nov 3, 2011
- Micron Technology, Inc.
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICONDUCTOR DEVICE AND...
- Publication number 20110266696
- Publication date Nov 3, 2011
- Micron Technology, Inc.
- Choon Kuan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20110062583
- Publication date Mar 17, 2011
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS...
- Publication number 20100320578
- Publication date Dec 23, 2010
- Micron Technology, Inc.
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS
- Publication number 20090236735
- Publication date Sep 24, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PL...
- Publication number 20090218677
- Publication date Sep 3, 2009
- Micron Technology, Inc.
- Lee Choon Kuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICRO...
- Publication number 20090011541
- Publication date Jan 8, 2009
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL BUILD-UP-PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...
- Publication number 20090001551
- Publication date Jan 1, 2009
- Ng Hong Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE
- Publication number 20080280396
- Publication date Nov 13, 2008
- Micron Technology, Inc.
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR STRUCTURE, AND METHODS...
- Publication number 20080224292
- Publication date Sep 18, 2008
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS...
- Publication number 20080197460
- Publication date Aug 21, 2008
- Choon Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20080136001
- Publication date Jun 12, 2008
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...
- Publication number 20070249100
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrierless chip package for integrated circuit devices, and method...
- Publication number 20070216033
- Publication date Sep 20, 2007
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked microelectronic devices and methods for manufacturing micro...
- Publication number 20070045862
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die package for peripheral and center device pad layout device
- Publication number 20060246622
- Publication date Nov 2, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked device package for peripheral and center device pad layout...
- Publication number 20060197206
- Publication date Sep 7, 2006
- Dalson Ye Seng Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a semiconductor package with multi layered l...
- Publication number 20050087847
- Publication date Apr 28, 2005
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor component with multi layered l...
- Publication number 20040130010
- Publication date Jul 8, 2004
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having multi-layer leadframe and method of fa...
- Publication number 20040080046
- Publication date Apr 29, 2004
- Lee Choon Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for encapsulating intermediate conductive elements connectin...
- Publication number 20020172024
- Publication date Nov 21, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOC semiconductor package including a semiconductor die and a subst...
- Publication number 20020100976
- Publication date Aug 1, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating BOC semiconductor package
- Publication number 20020102831
- Publication date Aug 1, 2002
- Chong Chin Hui
- H01 - BASIC ELECTRIC ELEMENTS

Chong Chin Hui

Person

Patents Grantslast 30 patents

Microelectronic devices with tiered decks of differing pillar densi...

Carrierless chip package for integrated circuit devices, and method...

Redistribution elements and semiconductor device packages including...

Interposer structure with embedded capacitor structure, and methods...

Methods of forming semiconductor device packages including a semico...

Semiconductor device packages including a semiconductor device and...

Stacked die package for peripheral and center device pad layout device

Semiconductor device packages and assemblies

Stacked die package for peripheral and center device pad layout device

Packaged IC device comprising an embedded flex circuit on leadframe...

Build-up-package for integrated circuit devices, and methods of mak...

Carrierless chip package for integrated circuit devices, and method...

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Method for fabricating a semiconductor package with multi layered l...

Method for fabricating semiconductor component with multi layered l...

Semiconductor component having multi layered leadframe

Method for encapsulating intermediate conductive elements connectin...

Method for fabricating BOC semiconductor package

BOC semiconductor package including a semiconductor die and a subst...

Patents Applicationslast 30 patents

SUBSTRATES WITH DOWNSET

MICROELECTRONIC DEVICES WITH TIERED DECKS OF ALIGNED PILLARS EXHIBI...

MICROELECTRONIC DEVICES WITH TIERED DECKS OF DIFFERING PILLAR DENSI...

REDISTRIBUTION ELEMENTS AND SEMICONDUCTOR DEVICE PACKAGES INCLUDING...

METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICO...

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

SEMICONDUCTOR DEVICE PACKAGES INCLUDING A SEMICONDUCTOR DEVICE AND...

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS...

UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS

BOARD-ON-CHIP TYPE SUBSTRATES WITH CONDUCTIVE TRACES IN MULTIPLE PL...

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICRO...

NOVEL BUILD-UP-PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS...

STACKED DIE PACKAGE FOR PERIPHERAL AND CENTER DEVICE PAD LAYOUT DEVICE

INTERPOSER STRUCTURE WITH EMBEDDED CAPACITOR STRUCTURE, AND METHODS...

PACKAGED IC DEVICE COMPRISING AN EMBEDDED FLEX CIRCUIT, AND METHODS...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

CARRIERLESS CHIP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHOD...

Carrierless chip package for integrated circuit devices, and method...

Stacked microelectronic devices and methods for manufacturing micro...

Stacked die package for peripheral and center device pad layout device

Stacked device package for peripheral and center device pad layout...

Method for fabricating a semiconductor package with multi layered l...

Method for fabricating semiconductor component with multi layered l...

Semiconductor package having multi-layer leadframe and method of fa...

Method for encapsulating intermediate conductive elements connectin...

BOC semiconductor package including a semiconductor die and a subst...

Method for fabricating BOC semiconductor package