Chong Han Lim

Person

  • Selangor, MY

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ROUGHENED CONDUCTIVE COMPONENTS

    • Publication number 20230317569
    • Publication date Oct 5, 2023
    • TEXAS INSTRUMENTS INCORPORATED
    • Yee Gin TEA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ROUGHENED CONDUCTIVE COMPONENTS

    • Publication number 20220208659
    • Publication date Jun 30, 2022
    • TEXAS INSTRUMENTS INCORPORATED
    • Yee Gin TEA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

    • Publication number 20210242038
    • Publication date Aug 5, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Anis Fauzi BIN ABDUL AZIZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LEADFRAME ASSEMBLY

    • Publication number 20210202356
    • Publication date Jul 1, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Chong Han LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS

    • Publication number 20210043466
    • Publication date Feb 11, 2021
    • TEXAS INSTRUMENTS INCORPORATED
    • Anis Fauzi BIN ABDUL AZIZ
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE

    • Publication number 20170213781
    • Publication date Jul 27, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • Lee Han Meng@Eugene Lee
    • H01 - BASIC ELECTRIC ELEMENTS