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Chong Han Lim
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Selangor, MY
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Patents Grants
last 30 patents
Information
Patent Grant
Roughened conductive components
Patent number
11,715,678
Issue date
Aug 1, 2023
Texas Instruments Incorporated
Yee Gin Tea
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cutting a leadframe assembly with a plurality of punching tools
Patent number
11,626,350
Issue date
Apr 11, 2023
Texas Instruments Incorporated
Chong Han Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package having an IC die between top and bottom...
Patent number
10,381,293
Issue date
Aug 13, 2019
Texas Instruments Incorporated
Lee Han Meng@Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ROUGHENED CONDUCTIVE COMPONENTS
Publication number
20230317569
Publication date
Oct 5, 2023
TEXAS INSTRUMENTS INCORPORATED
Yee Gin TEA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROUGHENED CONDUCTIVE COMPONENTS
Publication number
20220208659
Publication date
Jun 30, 2022
TEXAS INSTRUMENTS INCORPORATED
Yee Gin TEA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
Publication number
20210242038
Publication date
Aug 5, 2021
TEXAS INSTRUMENTS INCORPORATED
Anis Fauzi BIN ABDUL AZIZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME ASSEMBLY
Publication number
20210202356
Publication date
Jul 1, 2021
TEXAS INSTRUMENTS INCORPORATED
Chong Han LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS
Publication number
20210043466
Publication date
Feb 11, 2021
TEXAS INSTRUMENTS INCORPORATED
Anis Fauzi BIN ABDUL AZIZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE
Publication number
20170213781
Publication date
Jul 27, 2017
TEXAS INSTRUMENTS INCORPORATED
Lee Han Meng@Eugene Lee
H01 - BASIC ELECTRIC ELEMENTS