Chong Ho Kim

Person

Chungcheongbuk-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Via hole having fine hole land and method for forming the same
- Patent number 7,629,692
- Issue date Dec 8, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board having thin core layer
- Patent number 7,346,982
- Issue date Mar 25, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for and method of analyzing surface condition of PCB using R...
- Patent number 7,298,887
- Issue date Nov 20, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Hyo-Soo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate manufactured using electrolytic leadless plating...
- Patent number 7,030,500
- Issue date Apr 18, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Young-Hwan Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate manufactured using electrolytic leadless plating...
- Patent number 6,852,625
- Issue date Feb 8, 2005
- Samsung Electro-Mechanics Co., Ltd.
- Young-Hwan Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for forming via hole having fine hole land
- Publication number 20080209722
- Publication date Sep 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via hole having fine hole land and method for forming the same
- Publication number 20070132087
- Publication date Jun 14, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board having thin core layer
- Publication number 20060121256
- Publication date Jun 8, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Chong Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate manufactured using electrolytic leadless plating...
- Publication number 20050194696
- Publication date Sep 8, 2005
- SAMSUNG ELECTRO-MECHANICS CO.,LTD.
- Young-Hwan Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for and method of analyzing surface condition of PCB using R...
- Publication number 20040234119
- Publication date Nov 25, 2004
- Hyo-Soo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Package substrate manufactured using electrolytic leadless plating...
- Publication number 20040113244
- Publication date Jun 17, 2004
- Samsung Electro-Mechanics CO., LTD.
- Young-Hwan Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chong Ho Kim

Person

Patents Grantslast 30 patents

Via hole having fine hole land and method for forming the same

Method of fabricating printed circuit board having thin core layer

System for and method of analyzing surface condition of PCB using R...

Package substrate manufactured using electrolytic leadless plating...

Package substrate manufactured using electrolytic leadless plating...

Patents Applicationslast 30 patents

Method for forming via hole having fine hole land

Via hole having fine hole land and method for forming the same

Method of fabricating printed circuit board having thin core layer

Package substrate manufactured using electrolytic leadless plating...

System for and method of analyzing surface condition of PCB using R...

Package substrate manufactured using electrolytic leadless plating...