Chong-Ren Maa

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing solder mask of printed circuit board
- Patent number 7,080,447
- Issue date Jul 25, 2006
- Ultratera Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having permanent solder mask
- Patent number 6,933,448
- Issue date Aug 23, 2005
- S & S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having permanent solder mask
- Patent number 6,753,480
- Issue date Jun 22, 2004
- Ultratera Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming through holes in substrate of printed circuit b...
- Patent number 6,458,514
- Issue date Oct 1, 2002
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing solder mask of printed circuit board
- Patent number 6,395,625
- Issue date May 28, 2002
- S & S Technology Corporation
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip clip bonding leadframe-type packaging method for integrated ci...
- Patent number 6,258,622
- Issue date Jul 10, 2001
- Apack Technologies Inc.
- Albert Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving the reliability of underfill process for a chip
- Patent number 6,221,689
- Issue date Apr 24, 2001
- Apack Technologies Inc.
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale packaging method
- Patent number 6,190,943
- Issue date Feb 20, 2001
- United Test Center Inc.
- Cheng-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing solder mask of printed circuit board
- Publication number 20040172818
- Publication date Sep 9, 2004
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board having permanent solder mask
- Publication number 20040149681
- Publication date Aug 5, 2004
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of printed circuit board (PCB)
- Publication number 20040007386
- Publication date Jan 15, 2004
- S & S Technology Corporation
- Ching-Hua Tsou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire-bonded chip on board package
- Publication number 20030205793
- Publication date Nov 6, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip package
- Publication number 20030201544
- Publication date Oct 30, 2003
- Chong-Ren Maa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode device for a plasma processing system
- Publication number 20030184234
- Publication date Oct 2, 2003
- Nano Electronics and Micro System Technologies, Inc.
- Chia-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board having permanent solder mask
- Publication number 20030070835
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing solder mask of printed circuit board
- Publication number 20030072927
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing solder mask of printed circuit board
- Publication number 20030071014
- Publication date Apr 17, 2003
- S&S Technology Corporation
- Chong-Ren Maa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chong-Ren Maa

Person

Patents Grantslast 30 patents

Method of manufacturing solder mask of printed circuit board

Printed circuit board having permanent solder mask

Printed circuit board having permanent solder mask

Process for forming through holes in substrate of printed circuit b...

Method for manufacturing solder mask of printed circuit board

Flip clip bonding leadframe-type packaging method for integrated ci...

Method for improving the reliability of underfill process for a chip

Chip scale packaging method

Patents Applicationslast 30 patents

Method of manufacturing solder mask of printed circuit board

Printed circuit board having permanent solder mask

Structure of printed circuit board (PCB)

Wire-bonded chip on board package

Flip chip package

Electrode device for a plasma processing system

Printed circuit board having permanent solder mask

Method for manufacturing solder mask of printed circuit board

Method for manufacturing solder mask of printed circuit board