Chong Un Tan

Follow

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Ball grid array substrate
- Patent number 11,798,918
- Issue date Oct 24, 2023
- Western Digital Technologies, Inc.
- Muhammad Bashir Mansor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array substrate
- Patent number 11,195,786
- Issue date Dec 7, 2021
- Western Digital Technologies, Inc.
- Muhammad Bashir Mansor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of post-mold grinding a semiconductor package
- Patent number 8,124,471
- Issue date Feb 28, 2012
- Intel Corporation
- James-Yii Lee Kiong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bump chip lead frame and package
- Patent number 6,864,423
- Issue date Mar 8, 2005
- Semiconductor Component Industries, L.L.C.
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY SUBSTRATE
- Publication number 20220093570
- Publication date Mar 24, 2022
- Western Digital Technologies, Inc.
- MUHAMMAD BASHIR MANSOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SUBSTRATE
- Publication number 20210384114
- Publication date Dec 9, 2021
- Western Digital Technologies, Inc.
- MUHAMMAD BASHIR MANSOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20120175786
- Publication date Jul 12, 2012
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20090230567
- Publication date Sep 17, 2009
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump chip lead frame and package
- Publication number 20020074147
- Publication date Jun 20, 2002
- Semiconductor Components Industries, LLC.
- Aik Chong Tan
- H01 - BASIC ELECTRIC ELEMENTS