Chong Zhang

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 12,087,746
- Issue date Sep 10, 2024
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 12,019,269
- Issue date Jun 25, 2024
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid multi-wavelength source and associated methods
- Patent number 11,914,203
- Issue date Feb 27, 2024
- Ayar Labs, Inc.
- Michael Davenport
- G02 - OPTICS
Information Patent Grant
Vertical integrated photonics chiplet for in-package optical interc...
- Patent number 11,899,251
- Issue date Feb 13, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for passively-aligned optical waveguide edge-co...
- Patent number 11,762,154
- Issue date Sep 19, 2023
- Ayar Labs, Inc.
- Manan Raval
- G02 - OPTICS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,721,677
- Issue date Aug 8, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,696,407
- Issue date Jul 4, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 11,646,254
- Issue date May 9, 2023
- Tahoe Research, LTD.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographically defined vertical interconnect access (VIA) in diel...
- Patent number 11,640,934
- Issue date May 2, 2023
- Intel Corporation
- Meizi Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having an integrated capacitor
- Patent number 11,557,579
- Issue date Jan 17, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric cored integrated circuit package supports
- Patent number 11,552,008
- Issue date Jan 10, 2023
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including fully integrated voltage regulator circuitry with...
- Patent number 11,527,483
- Issue date Dec 13, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having a cooling channel
- Patent number 11,521,914
- Issue date Dec 6, 2022
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging of silicon photonics
- Patent number 11,500,153
- Issue date Nov 15, 2022
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,482,471
- Issue date Oct 25, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic structures in integrated circuit packages
- Patent number 11,444,042
- Issue date Sep 13, 2022
- Intel Corporation
- Andrew James Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid multi-wavelength source and associated methods
- Patent number 11,422,322
- Issue date Aug 23, 2022
- Ayar Labs, Inc.
- Michael Davenport
- G02 - OPTICS
Information Patent Grant
Phase change material in substrate cavity
- Patent number 11,387,224
- Issue date Jul 12, 2022
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Techniques for an inductor at a first level interface
- Patent number 11,322,290
- Issue date May 3, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
- Patent number 11,246,218
- Issue date Feb 8, 2022
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level handle replacement processing
- Patent number 11,156,773
- Issue date Oct 26, 2021
- Ayar Labs, Inc.
- Haiwei Lu
- G02 - OPTICS
Information Patent Grant
Techniques for an inductor at a second level interface
- Patent number 11,031,360
- Issue date Jun 8, 2021
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including a lateral trace
- Patent number 10,804,188
- Issue date Oct 13, 2020
- Intel Corporation
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate with through-hole magnetic core ind...
- Patent number 10,790,159
- Issue date Sep 29, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for an inductor at a second level interface
- Patent number 10,777,514
- Issue date Sep 15, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D conductive ink printing method and inductor formed thereof
- Patent number 10,692,965
- Issue date Jun 23, 2020
- Intel Corporation
- Chong Zhang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Embedded magnetic inductor
- Patent number 10,672,859
- Issue date Jun 2, 2020
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acousto-optics deflector and mirror for laser beam steering
- Patent number 10,286,488
- Issue date May 14, 2019
- Intel Corporation
- Chong Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Reflowable Optical Fiber Connector
- Publication number 20250012980
- Publication date Jan 9, 2025
- Ayar Labs, Inc.
- Jianhua Li
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20240405006
- Publication date Dec 5, 2024
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20240176081
- Publication date May 30, 2024
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20240088052
- Publication date Mar 14, 2024
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Passively-Aligned Optical Waveguide Edge-Co...
- Publication number 20230418005
- Publication date Dec 28, 2023
- Ayar Labs, Inc.
- Manan Raval
- G02 - OPTICS
Information Patent Application
High-Temperature-Compatible Fiber Array Packaging Methods
- Publication number 20230408767
- Publication date Dec 21, 2023
- Ayar Labs, Inc.
- Derek M. Kita
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20230352385
- Publication date Nov 2, 2023
- Tahoe Research, Ltd.
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20230238368
- Publication date Jul 27, 2023
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR ON A GLASS SUBSTRATE
- Publication number 20230197351
- Publication date Jun 22, 2023
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
- Publication number 20230187205
- Publication date Jun 15, 2023
- Intel Corporation
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Packaging of Silicon Photonics
- Publication number 20230070458
- Publication date Mar 9, 2023
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Application
Hybrid Multi-Wavelength Source and Associated Methods
- Publication number 20220390691
- Publication date Dec 8, 2022
- Ayar Labs, Inc.
- Michael Davenport
- G02 - OPTICS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
- Publication number 20220230800
- Publication date Jul 21, 2022
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
- Publication number 20220117089
- Publication date Apr 14, 2022
- Intel Corporation
- Chong ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Passively-Aligned Optical Waveguide Edge-Co...
- Publication number 20220035107
- Publication date Feb 3, 2022
- Ayar Labs, Inc.
- Manan Raval
- G02 - OPTICS
Information Patent Application
Vertical Integrated Photonics Chiplet for In-Package Optical Interc...
- Publication number 20210132309
- Publication date May 6, 2021
- Ayar Labs, Inc.
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20210111166
- Publication date Apr 15, 2021
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Packaging of Silicon Photonics
- Publication number 20210109284
- Publication date Apr 15, 2021
- Ayar Labs, Inc.
- Roy Edward Meade
- G02 - OPTICS
Information Patent Application
Wafer-Level Handle Replacement Processing
- Publication number 20210080647
- Publication date Mar 18, 2021
- Ayar Labs, Inc.
- Haiwei Lu
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
- Publication number 20210020558
- Publication date Jan 21, 2021
- Intel Corporation
- Yikang DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Multi-Wavelength Source and Associated Methods
- Publication number 20210011233
- Publication date Jan 14, 2021
- Ayar Labs, Inc.
- Michael Davenport
- G02 - OPTICS
Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
- Publication number 20200373257
- Publication date Nov 26, 2020
- Intel Corporation
- Cheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
- Publication number 20200312738
- Publication date Oct 1, 2020
- Intel Corporation
- Junnan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
- Publication number 20200312771
- Publication date Oct 1, 2020
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200273776
- Publication date Aug 27, 2020
- Intel Corporation
- Cheng Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
- Publication number 20200211927
- Publication date Jul 2, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
- Publication number 20200212020
- Publication date Jul 2, 2020
- Intel Corporation
- Chong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
- Publication number 20200168536
- Publication date May 28, 2020
- Intel Corporation
- Lauren Ashley Link
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
- Publication number 20200118990
- Publication date Apr 16, 2020
- Intel Corporation
- Cheng Xu
- F28 - HEAT EXCHANGE IN GENERAL

Chong Zhang

Person

Patents Grantslast 30 patents

Microelectronic assemblies having an integrated capacitor

Multi-chip packaging of silicon photonics

Patternable die attach materials and processes for patterning

Hybrid multi-wavelength source and associated methods

Vertical integrated photonics chiplet for in-package optical interc...

Systems and methods for passively-aligned optical waveguide edge-co...

Microelectronic assemblies having an integrated capacitor

Vias for package substrates

Core layer with fully encapsulated co-axial magnetic material aroun...

Electronic device including a lateral trace

Lithographically defined vertical interconnect access (VIA) in diel...

Microelectronic assemblies having an integrated capacitor

Asymmetric cored integrated circuit package supports

Package including fully integrated voltage regulator circuitry with...

Microelectronic assemblies having a cooling channel

Multi-chip packaging of silicon photonics

Thermal management solutions for integrated circuit packages

Magnetic structures in integrated circuit packages

Hybrid multi-wavelength source and associated methods

Phase change material in substrate cavity

Techniques for an inductor at a first level interface

Core layer with fully encapsulated co-axial magnetic material aroun...

Wafer-level handle replacement processing

Techniques for an inductor at a second level interface

Electronic device including a lateral trace

Semiconductor package substrate with through-hole magnetic core ind...

Techniques for an inductor at a second level interface

3D conductive ink printing method and inductor formed thereof

Embedded magnetic inductor

Acousto-optics deflector and mirror for laser beam steering

Patents Applicationslast 30 patents

Reflowable Optical Fiber Connector

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

Systems and Methods for Passively-Aligned Optical Waveguide Edge-Co...

High-Temperature-Compatible Fiber Array Packaging Methods

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

FILM CAPACITOR ON A GLASS SUBSTRATE

SUBSTRATE PACKAGE WITH GLASS DIELECTRIC

Multi-Chip Packaging of Silicon Photonics

Hybrid Multi-Wavelength Source and Associated Methods

TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE

CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...

Systems and Methods for Passively-Aligned Optical Waveguide Edge-Co...

Vertical Integrated Photonics Chiplet for In-Package Optical Interc...

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

Multi-Chip Packaging of Silicon Photonics

Wafer-Level Handle Replacement Processing

ELECTRONIC DEVICE INCLUDING A LATERAL TRACE

Hybrid Multi-Wavelength Source and Associated Methods

VIAS FOR PACKAGE SUBSTRATES

TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE

THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...

PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING

THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES

MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS

PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY