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Chong Zhang
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Patternable die attach materials and processes for patterning
Patent number
11,923,312
Issue date
Mar 5, 2024
Intel Corporation
Bai Nie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having an integrated capacitor
Patent number
11,721,677
Issue date
Aug 8, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vias for package substrates
Patent number
11,705,389
Issue date
Jul 18, 2023
Intel Corporation
Andrew J. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
Patent number
11,696,407
Issue date
Jul 4, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lithographically defined vertical interconnect access (VIA) in diel...
Patent number
11,640,934
Issue date
May 2, 2023
Intel Corporation
Meizi Jiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having an integrated capacitor
Patent number
11,557,579
Issue date
Jan 17, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Asymmetric cored integrated circuit package supports
Patent number
11,552,008
Issue date
Jan 10, 2023
Intel Corporation
Lauren Ashley Link
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package including fully integrated voltage regulator circuitry with...
Patent number
11,527,483
Issue date
Dec 13, 2022
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic assemblies having a cooling channel
Patent number
11,521,914
Issue date
Dec 6, 2022
Intel Corporation
Zhimin Wan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,482,471
Issue date
Oct 25, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic structures in integrated circuit packages
Patent number
11,444,042
Issue date
Sep 13, 2022
Intel Corporation
Andrew James Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Phase change material in substrate cavity
Patent number
11,387,224
Issue date
Jul 12, 2022
Intel Corporation
Cheng Xu
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Techniques for an inductor at a first level interface
Patent number
11,322,290
Issue date
May 3, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Core layer with fully encapsulated co-axial magnetic material aroun...
Patent number
11,246,218
Issue date
Feb 8, 2022
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
11,031,360
Issue date
Jun 8, 2021
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including a lateral trace
Patent number
10,804,188
Issue date
Oct 13, 2020
Intel Corporation
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package substrate with through-hole magnetic core ind...
Patent number
10,790,159
Issue date
Sep 29, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Techniques for an inductor at a second level interface
Patent number
10,777,514
Issue date
Sep 15, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D conductive ink printing method and inductor formed thereof
Patent number
10,692,965
Issue date
Jun 23, 2020
Intel Corporation
Chong Zhang
G05 - CONTROLLING REGULATING
Information
Patent Grant
Embedded magnetic inductor
Patent number
10,672,859
Issue date
Jun 2, 2020
Intel Corporation
Andrew J. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Acousto-optics deflector and mirror for laser beam steering
Patent number
10,286,488
Issue date
May 14, 2019
Intel Corporation
Chong Zhang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal protected fan-out cavity
Patent number
9,953,959
Issue date
Apr 24, 2018
Intel Corporation
Kristof Darmawikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with bi-layered dielectric structure
Patent number
9,917,044
Issue date
Mar 13, 2018
Intel Corporation
Zheng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spaced configuration of acousto-optic deflectors for laser beam sca...
Patent number
9,442,286
Issue date
Sep 13, 2016
Intel Corporation
Yonggang Li
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser cavity formation for embedded dies or components in substrate...
Patent number
9,202,803
Issue date
Dec 1, 2015
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structures for embedded bridge
Patent number
9,147,638
Issue date
Sep 29, 2015
Intel Corporation
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with high density interconnect design to capture...
Patent number
9,119,313
Issue date
Aug 25, 2015
Intel Corporation
Chong Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser beam shaping for pitchfork profile
Patent number
7,630,147
Issue date
Dec 8, 2009
University of Central Florida Research Foundation, Inc.
Aravinda Kar
G02 - OPTICS
Patents Applications
last 30 patents
Information
Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Publication number
20240088052
Publication date
Mar 14, 2024
Intel Corporation
Bai NIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
Publication number
20230238368
Publication date
Jul 27, 2023
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
Publication number
20230187205
Publication date
Jun 15, 2023
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
Publication number
20220230800
Publication date
Jul 21, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
Publication number
20220117089
Publication date
Apr 14, 2022
Intel Corporation
Chong ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
Publication number
20210111166
Publication date
Apr 15, 2021
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
Publication number
20210020558
Publication date
Jan 21, 2021
Intel Corporation
Yikang DENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
VIAS FOR PACKAGE SUBSTRATES
Publication number
20200395282
Publication date
Dec 17, 2020
Intel Corporation
Andrew J. BROWN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
Publication number
20200373257
Publication date
Nov 26, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS USING COMPARTMENTALIZED PHASE CHANGE M...
Publication number
20200312738
Publication date
Oct 1, 2020
Intel Corporation
Junnan Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING
Publication number
20200312771
Publication date
Oct 1, 2020
Intel Corporation
Bai NIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20200273776
Publication date
Aug 27, 2020
Intel Corporation
Cheng Xu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A COOLING CHANNEL
Publication number
20200211927
Publication date
Jul 2, 2020
Intel Corporation
Zhimin Wan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR
Publication number
20200212020
Publication date
Jul 2, 2020
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS
Publication number
20200168536
Publication date
May 28, 2020
Intel Corporation
Lauren Ashley Link
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHASE CHANGE MATERIAL IN SUBSTRATE CAVITY
Publication number
20200118990
Publication date
Apr 16, 2020
Intel Corporation
Cheng Xu
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
IN-SITU FORMATION OF A THERMOELECTRIC DEVICE IN A SUBSTRATE PACKAGING
Publication number
20200119250
Publication date
Apr 16, 2020
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D CONDUCTIVE INK PRINTING METHOD AND INDUCTOR FORMED THEREOF
Publication number
20200098848
Publication date
Mar 26, 2020
Chong Zhang
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ELECTRONIC DEVICE INCLUDING A LATERAL TRACE
Publication number
20200083153
Publication date
Mar 12, 2020
Yikang Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PACKAGE WITH GLASS DIELECTRIC
Publication number
20200027728
Publication date
Jan 23, 2020
Intel Corporation
Ying Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MAGNETIC INDUCTOR
Publication number
20200006464
Publication date
Jan 2, 2020
Andrew J. Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY INTEGRATED VOLTAGE REGULATOR CIRCUITRY WITHIN A SUBSTRATE
Publication number
20200006239
Publication date
Jan 2, 2020
Intel Corporation
Chong ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A FIRST LEVEL INTERFACE
Publication number
20190385780
Publication date
Dec 19, 2019
Intel Corporation
Cheng Xu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
TECHNIQUES FOR AN INDUCTOR AT A SECOND LEVEL INTERFACE
Publication number
20190385959
Publication date
Dec 19, 2019
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC STRUCTURES IN INTEGRATED CIRCUIT PACKAGES
Publication number
20190371744
Publication date
Dec 5, 2019
Intel Corporation
Andrew James Brown
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LITHOGRAPHICALLY DEFINED VERTICAL INTERCONNECT ACCESS (VIA) IN DIEL...
Publication number
20190304889
Publication date
Oct 3, 2019
Intel Corporation
Meizi JIAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
NON-ROUGHENED CU TRACE WITH ANCHORING TO REDUCE INSERTION LOSS OF H...
Publication number
20190295937
Publication date
Sep 26, 2019
Intel Corporation
Chong ZHANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH THROUGH-HOLE MAGNETIC CORE IND...
Publication number
20190287815
Publication date
Sep 19, 2019
Intel Corporation
Cheng XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORE LAYER WITH FULLY ENCAPSULATED CO-AXIAL MAGNETIC MATERIAL AROUN...
Publication number
20190274217
Publication date
Sep 5, 2019
Intel Corporation
Chong ZHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FULLY EMBEDDED MAGNETIC-CORE IN CORE LAYER FOR CUSTOM INDUCTOR IN I...
Publication number
20190272936
Publication date
Sep 5, 2019
Intel Corporation
Chong ZHANG
G05 - CONTROLLING REGULATING