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Wuxi City, CN
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last 30 patents
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Patent Grant
TSV backside reveal structure and exposing process
Patent number
9,076,699
Issue date
Jul 7, 2015
National Center for Advanced Packaging Co., Ltd.
Wenqi Zhang
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
TSV Backside Reveal Structure and Exposing Process
Publication number
20140327132
Publication date
Nov 6, 2014
National Center for Advanced Packaging (NCAP China)
Wenqi ZHANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TSV Backside Reveal Structure and Exposing Process
Publication number
20140329381
Publication date
Nov 6, 2014
National Center for Advanced Packaging (NCAP China)
Wenqi ZHANG
H01 - BASIC ELECTRIC ELEMENTS