Chongyang Wang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sequencer time leaping execution
- Patent number 12,009,237
- Issue date Jun 11, 2024
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for cleaning process sequence management
- Patent number 11,874,649
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Chongyang C. Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Sequencer time leaping execution
- Patent number 11,437,254
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheduling substrate routing and processing
- Patent number 11,385,628
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 8,550,031
- Issue date Oct 8, 2013
- Applied Materials, Inc.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method and system for managing process jobs in a semiconductor fabr...
- Patent number 8,527,080
- Issue date Sep 3, 2013
- Applied Materials, Inc.
- Shay Assaf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 8,215,262
- Issue date Jul 10, 2012
- Applied Materials, Inc.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 8,181,596
- Issue date May 22, 2012
- Applied Materials, Inc.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 8,146,530
- Issue date Apr 3, 2012
- Applied Materials, Inc.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Scheduling method for processing equipment
- Patent number 8,019,467
- Issue date Sep 13, 2011
- Applied Materials, Inc.
- Steve S. Hongkham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 7,925,377
- Issue date Apr 12, 2011
- Applied Materials, Inc.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 7,743,728
- Issue date Jun 29, 2010
- Applied Materials, Inc.
- Tetsuya Ishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 7,694,647
- Issue date Apr 13, 2010
- Applied Materials, Inc.
- Tetsuya Ishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Scheduling method for processing equipment
- Patent number 7,522,968
- Issue date Apr 21, 2009
- Applied Materials, Inc.
- Steve S. Hongkham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cluster tool architecture for processing a substrate
- Patent number 7,357,842
- Issue date Apr 15, 2008
- Sokudo Co., Ltd.
- Tetsuya Ishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Apparatus, method and medium for enhancing the throughput of a wafe...
- Patent number 6,580,955
- Issue date Jun 17, 2003
- Applied Materials, Inc.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, method and medium for enhancing the throughput of a wafe...
- Patent number 6,449,520
- Issue date Sep 10, 2002
- Applied Materials, Inc.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, method and medium for enhancing the throughput of a wafe...
- Patent number 6,360,132
- Issue date Mar 19, 2002
- Applied Materials, Inc.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, method and medium for enhancing the throughput of a wafe...
- Patent number 6,201,998
- Issue date Mar 13, 2001
- Applied Materials, Inc.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, method and medium for enhancing the throughput of a wafe...
- Patent number 5,975,740
- Issue date Nov 2, 1999
- Applied Materials, Inc.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR CLEANING PROCESS SEQUENCE MANAGEMENT
- Publication number 20230147627
- Publication date May 11, 2023
- Applied Materials, Inc.
- Chongyang C. Wang
- G05 - CONTROLLING REGULATING
Information Patent Application
SEQUENCER TIME LEAPING EXECUTION
- Publication number 20220415682
- Publication date Dec 29, 2022
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEDULING SUBSTRATE ROUTING AND PROCESSING
- Publication number 20220365516
- Publication date Nov 17, 2022
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEDULING SUBSTRATE ROUTING AND PROCESSING
- Publication number 20210405625
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEQUENCER TIME LEAPING EXECUTION
- Publication number 20210405626
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Chongyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20120320361
- Publication date Dec 20, 2012
- Tetsuya Ishikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20120180983
- Publication date Jul 19, 2012
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
METHOD AND SYSTEM FOR MANAGING PROCESS JOBS IN A SEMICONDUCTOR FABR...
- Publication number 20100087941
- Publication date Apr 8, 2010
- Shay Assaf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20090067956
- Publication date Mar 12, 2009
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20090064928
- Publication date Mar 12, 2009
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20090064929
- Publication date Mar 12, 2009
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20080223293
- Publication date Sep 18, 2008
- Sokudo Co,. Ltd.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
SOFTWARE SEQUENCER FOR INTEGRATED SUBSTRATE PROCESSING SYSTEM
- Publication number 20080216077
- Publication date Sep 4, 2008
- APPLIED MATERIALS, INC.
- Shyam Emani
- G05 - CONTROLLING REGULATING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20080199282
- Publication date Aug 21, 2008
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
SCHEDULING METHOD FOR PROCESSING EQUIPMENT
- Publication number 20080051929
- Publication date Feb 28, 2008
- STEVE S. HONGKHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEDULING METHOD FOR PROCESSING EQUIPMENT
- Publication number 20080051930
- Publication date Feb 28, 2008
- Hilario L. OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEDULING METHOD FOR PROCESSING EQUIPMENT
- Publication number 20080014058
- Publication date Jan 17, 2008
- STEVE S. HONGKHAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Software sequencer to dynamically adjust wafer transfer decision
- Publication number 20070003842
- Publication date Jan 4, 2007
- Applied Materials, Inc.
- Chongyang Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20060286300
- Publication date Dec 21, 2006
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE
- Publication number 20060278165
- Publication date Dec 14, 2006
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
Cluster tool architecture for processing a substrate
- Publication number 20060130750
- Publication date Jun 22, 2006
- APPLIED MATERIALS, INC.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
Cluster tool architecture for processing a substrate
- Publication number 20060134330
- Publication date Jun 22, 2006
- APPLIED MATERIALS, INC.
- Tetsuya Ishikawa
- G05 - CONTROLLING REGULATING
Information Patent Application
Apparatus, method and medium for enhancing the throughput of a wafe...
- Publication number 20030009251
- Publication date Jan 9, 2003
- APPLIED MATERIALS, INC.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus, method and medium for enhancing the throughput of a wafe...
- Publication number 20020055799
- Publication date May 9, 2002
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Apparatus, method and medium for enhancing the throughput of a wafe...
- Publication number 20010001839
- Publication date May 24, 2001
- APPLIED MATERIALS, INC.
- Zhihong J. Lin
- G06 - COMPUTING CALCULATING COUNTING

Chongyang Wang

Person

Patents Grantslast 30 patents

Sequencer time leaping execution

Methods and systems for cleaning process sequence management

Sequencer time leaping execution

Scheduling substrate routing and processing

Cluster tool architecture for processing a substrate

Method and system for managing process jobs in a semiconductor fabr...

Cluster tool architecture for processing a substrate

Cluster tool architecture for processing a substrate

Cluster tool architecture for processing a substrate

Scheduling method for processing equipment

Cluster tool architecture for processing a substrate

Cluster tool architecture for processing a substrate

Cluster tool architecture for processing a substrate

Scheduling method for processing equipment

Cluster tool architecture for processing a substrate

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR CLEANING PROCESS SEQUENCE MANAGEMENT

SEQUENCER TIME LEAPING EXECUTION

SCHEDULING SUBSTRATE ROUTING AND PROCESSING

SCHEDULING SUBSTRATE ROUTING AND PROCESSING

SEQUENCER TIME LEAPING EXECUTION

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

METHOD AND SYSTEM FOR MANAGING PROCESS JOBS IN A SEMICONDUCTOR FABR...

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

SOFTWARE SEQUENCER FOR INTEGRATED SUBSTRATE PROCESSING SYSTEM

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

SCHEDULING METHOD FOR PROCESSING EQUIPMENT

SCHEDULING METHOD FOR PROCESSING EQUIPMENT

SCHEDULING METHOD FOR PROCESSING EQUIPMENT

Software sequencer to dynamically adjust wafer transfer decision

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

CLUSTER TOOL ARCHITECTURE FOR PROCESSING A SUBSTRATE

Cluster tool architecture for processing a substrate

Cluster tool architecture for processing a substrate

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...

Apparatus, method and medium for enhancing the throughput of a wafe...