Chooi Mei Chong

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package and method for fabricating a power semi...
- Patent number 11,211,356
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with flat contacts to prevent bottleneck
- Patent number 10,699,987
- Issue date Jun 30, 2020
- tInfineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for multiphase circuitry device
- Patent number 10,147,703
- Issue date Dec 4, 2018
- Infineon Technologies AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having contact pins at short side edges
- Patent number 10,037,934
- Issue date Jul 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor arrangement with semiconductor chips between two substrates
- Patent number 9,806,029
- Issue date Oct 31, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor power device
- Patent number 9,515,060
- Issue date Dec 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 9,368,435
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level semiconductor package
- Patent number 9,041,170
- Issue date May 26, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangements, a chip package and a method for manufacturing a...
- Patent number 8,853,835
- Issue date Oct 7, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor packages and assembly thereof
- Patent number 8,836,101
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package and Method for Fabricating a Power Semi...
- Publication number 20210057375
- Publication date Feb 25, 2021
- Wee Aun Jason Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20200168575
- Publication date May 28, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20200083207
- Publication date Mar 12, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package
- Publication number 20180301398
- Publication date Oct 18, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE
- Publication number 20180277513
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Stefan Macheiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Multi-Chip Semiconductor Power Device
- Publication number 20170047315
- Publication date Feb 16, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Contact Pins at Short Side Edges
- Publication number 20160233149
- Publication date Aug 11, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086876
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20160056092
- Publication date Feb 25, 2016
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transistor arrangement with semiconductor chips between two substrates
- Publication number 20150092375
- Publication date Apr 2, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Level Semiconductor Package
- Publication number 20140291849
- Publication date Oct 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Power Device
- Publication number 20140284777
- Publication date Sep 25, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip Semiconductor Packages and Assembly Thereof
- Publication number 20120074546
- Publication date Mar 29, 2012
- Chooi Mei Chong
- H01 - BASIC ELECTRIC ELEMENTS

Chooi Mei Chong

Person

Patents Grantslast 30 patents

Semiconductor device having a contact clip with a contact region ha...

Power semiconductor package and method for fabricating a power semi...

Semiconductor device and method for fabricating a semiconductor device

SMD package with flat contacts to prevent bottleneck

Semiconductor chip package having a repeating footprint pattern

Semiconductor package for multiphase circuitry device

Semiconductor chip package having contact pins at short side edges

Transistor arrangement with semiconductor chips between two substrates

Multi-chip semiconductor power device

Electronic component

Multi-level semiconductor package

Semiconductor device using diffusion soldering

Chip arrangements, a chip package and a method for manufacturing a...

Multi-chip semiconductor packages and assembly thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

Power Semiconductor Package and Method for Fabricating a Power Semi...

Semiconductor Device and Method for Fabricating a Semiconductor Device

Method of Manufacturing a Multi-Chip Semiconductor Power Device

SMD Package

SEMICONDUCTOR PACKAGE FOR MULTIPHASE CIRCUITRY DEVICE

Leadframe and method of manufacturing the same

Semiconductor Chip Package Having a Repeating Footprint Pattern

Method of Manufacturing a Multi-Chip Semiconductor Power Device

Semiconductor Chip Package Having Contact Pins at Short Side Edges

Electronic Component

Leadframe and method of manufacturing the same

Transistor arrangement with semiconductor chips between two substrates

Multi-Level Semiconductor Package

Multi-Chip Semiconductor Power Device

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Semiconductor Device Using Diffusion Soldering

Multi-chip Semiconductor Packages and Assembly Thereof