Choon Huey Wang

Follow

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 10,490,470
- Issue date Nov 26, 2019
- Infineon Technologies AG
- Hock Heng Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for simultaneously encapsulating semiconductor...
- Patent number 10,099,411
- Issue date Oct 16, 2018
- Infineon Technologies AG
- Choon Huey Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor package and method for fabricating a semiconductor pa...
- Publication number 20180174935
- Publication date Jun 21, 2018
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Simultaneously Encapsulating Semiconductor...
- Publication number 20160339616
- Publication date Nov 24, 2016
- INFINEON TECHNOLOGIES AG
- Choon Huey Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL