Choong Bin Yim

Person

Kyungki-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging apparatus formed from semiconductor package...
- Patent number 9,245,863
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hae-jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 9,190,401
- Issue date Nov 17, 2015
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package and method of fabricating the same
- Patent number 8,952,513
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 8,759,959
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with contoured encapsulation and...
- Patent number 8,530,280
- Issue date Sep 10, 2013
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package on package system
- Patent number 8,367,465
- Issue date Feb 5, 2013
- Stats Chippac Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having ink-jet type dam and method of manufac...
- Patent number 8,187,921
- Issue date May 29, 2012
- Samsung Electronics Co., Ltd.
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system and method for making...
- Patent number 8,049,322
- Issue date Nov 1, 2011
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having ink-jet type dam and method of manufac...
- Patent number 7,999,368
- Issue date Aug 16, 2011
- Samsung Electronics Co., Ltd.
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with contoured encapsulation
- Patent number 7,985,623
- Issue date Jul 26, 2011
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with carrier and method of manu...
- Patent number 7,884,460
- Issue date Feb 8, 2011
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system
- Patent number 7,755,180
- Issue date Jul 13, 2010
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit leadframe package system
- Patent number 7,679,169
- Issue date Mar 16, 2010
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system
- Patent number 7,501,697
- Issue date Mar 10, 2009
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,482,203
- Issue date Jan 27, 2009
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit leadframe package system
- Patent number 7,446,396
- Issue date Nov 4, 2008
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,312,519
- Issue date Dec 25, 2007
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system with recessed...
- Patent number 7,298,037
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-in-package system
- Patent number 7,288,835
- Issue date Oct 30, 2007
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating cob type semiconductor package
- Patent number 6,124,152
- Issue date Sep 26, 2000
- Lg Semicon Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105567
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055398
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111343
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Choong Bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20140091463
- Publication date Apr 3, 2014
- Hae-jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120168917
- Publication date Jul 5, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Choong-bin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INK-JET TYPE DAM AND METHOD OF MANUFAC...
- Publication number 20110275177
- Publication date Nov 10, 2011
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION AND...
- Publication number 20110260313
- Publication date Oct 27, 2011
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Packages
- Publication number 20110215451
- Publication date Sep 8, 2011
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD FOR MAKING...
- Publication number 20100230796
- Publication date Sep 16, 2010
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INK-JET TYPE DAM AND METHOD OF MANUFAC...
- Publication number 20100078791
- Publication date Apr 1, 2010
- Choong-bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANU...
- Publication number 20090134509
- Publication date May 28, 2009
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and semiconductor module having the same
- Publication number 20090065949
- Publication date Mar 12, 2009
- Samsung Electronics Co., Ltd.
- Choong-Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM
- Publication number 20090026597
- Publication date Jan 29, 2009
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20080105965
- Publication date May 8, 2008
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20080006925
- Publication date Jan 10, 2008
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION
- Publication number 20070262473
- Publication date Nov 15, 2007
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
- Publication number 20070216006
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- DongSam Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070216010
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20070216005
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20070158810
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS

Choong Bin Yim

Person

Patents Grantslast 30 patents

Semiconductor packaging apparatus formed from semiconductor package...

Stacked semiconductor packages

Stack type semiconductor package and method of fabricating the same

Stacked semiconductor packages

Integrated circuit package system with contoured encapsulation and...

Integrated circuit package on package system

Semiconductor package having ink-jet type dam and method of manufac...

Integrated circuit package-in-package system and method for making...

Semiconductor package having ink-jet type dam and method of manufac...

Integrated circuit package system with contoured encapsulation

Integrated circuit packaging system with carrier and method of manu...

Integrated circuit package-in-package system

Stacked integrated circuit leadframe package system

Integrated circuit package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit leadframe package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system with recessed...

Integrated circuit package-in-package system

Method for fabricating cob type semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE APPARATUS

STACK TYPE SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE HAVING INK-JET TYPE DAM AND METHOD OF MANUFAC...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION AND...

Stacked Semiconductor Packages

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM AND METHOD FOR MAKING...

SEMICONDUCTOR PACKAGE HAVING INK-JET TYPE DAM AND METHOD OF MANUFAC...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CARRIER AND METHOD OF MANU...

Semiconductor package and semiconductor module having the same

STACKED INTEGRATED CIRCUIT LEADFRAME PACKAGE SYSTEM

Stacked integrated circuit package-in-package system

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION

INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

Stacked integrated circuit package-in-package system