ChoonHeung Lee

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of compartment shielding using bond...
- Patent number 12,009,314
- Issue date Jun 11, 2024
- STATS ChipPAC Pte. Ltd.
- YoungCheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of compartment shielding using bond...
- Patent number 11,450,618
- Issue date Sep 20, 2022
- STATS ChipPAC Pte. Ltd.
- YoungCheol Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Compartment Shielding Using Bond...
- Publication number 20220384361
- Publication date Dec 1, 2022
- STATS ChipPAC Pte Ltd.
- YoungCheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Compartment Shielding Using Bond...
- Publication number 20210225778
- Publication date Jul 22, 2021
- STATS ChipPAC Pte Ltd.
- YoungCheol Kim
- H01 - BASIC ELECTRIC ELEMENTS