Chou-Chin Weng

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Substrate packaging structure and packaging method thereof
- Patent number 10,058,955
- Issue date Aug 28, 2018
- AU OPTRONICS CORPORATION
- Chih-Hung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of light emitting device and forming method of o...
- Patent number 8,703,529
- Issue date Apr 22, 2014
- Au Optronics Corporation
- Eng-Jay Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PACKAGING STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20150202715
- Publication date Jul 23, 2015
- AU OPTRONICS CORPORATION
- Chih-Hung HSIAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING METHOD OF LIGHT EMITTING DEVICE AND FORMING METHOD OF O...
- Publication number 20130130422
- Publication date May 23, 2013
- AU OPTRONICS CORPORATION
- Eng-Jay Chen
- H01 - BASIC ELECTRIC ELEMENTS