Chou Kee Liu

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Kowloon, HK

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for semiconductor chip detachment
- Patent number 7,240,422
- Issue date Jul 10, 2007
- ASM Assembly Automation LTD
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed pick and place apparatus
- Patent number 6,758,113
- Issue date Jul 6, 2004
- ASM Assembly Automation Limited
- Ping Kong Choy
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for semicondutor chip detachment
- Publication number 20050255673
- Publication date Nov 17, 2005
- ASM Assembly Automation Ltd
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for alignment of a bonding tool
- Publication number 20050155712
- Publication date Jul 21, 2005
- ASM Assembly Automation Ltd
- Lai Wa Helen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High speed pick and place apparatus
- Publication number 20030013322
- Publication date Jan 16, 2003
- Ping Kong Choy
- H01 - BASIC ELECTRIC ELEMENTS