Chouhei Okuno

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer mounting method and semiconductor wafer mountin...
- Patent number 9,159,598
- Issue date Oct 13, 2015
- Nitto Denko Corporation
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and apparatus for separating protective tape
- Patent number 8,679,289
- Issue date Mar 25, 2014
- Nitto Denko Corporation
- Chouhei Okuno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Label joining method and label joining apparatus
- Patent number 7,922,857
- Issue date Apr 12, 2011
- Nitto Denko Corporation
- Chouhei Okuno
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...
- Publication number 20120298283
- Publication date Nov 29, 2012
- Masayuki Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE
- Publication number 20120090763
- Publication date Apr 19, 2012
- Chouhei Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110232820
- Publication date Sep 29, 2011
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT DEVICE
- Publication number 20110236171
- Publication date Sep 29, 2011
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING APPARATUS AND ADHESIVE TAPE JOINING METHOD
- Publication number 20110120641
- Publication date May 26, 2011
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS
- Publication number 20110017391
- Publication date Jan 27, 2011
- Masayuki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR W...
- Publication number 20100038009
- Publication date Feb 18, 2010
- Chouhei Okuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LABEL JOINING METHOD AND LABEL JOINING APPARATUS
- Publication number 20090133815
- Publication date May 28, 2009
- Chouhei Okuno
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Chouhei Okuno

Person

Patents Grantslast 30 patents

Semiconductor wafer mounting method and semiconductor wafer mountin...

Method and apparatus for separating protective tape

Label joining method and label joining apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTIN...

METHOD AND APPARATUS FOR SEPARATING PROTECTIVE TAPE

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

WORKPIECE TRANSPORT METHOD AND WORKPIECE TRANSPORT DEVICE

ADHESIVE TAPE JOINING APPARATUS AND ADHESIVE TAPE JOINING METHOD

ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS

METHOD AND APPARATUS FOR JOINING PROTECTIVE TAPE TO SEMICONDUCTOR W...

LABEL JOINING METHOD AND LABEL JOINING APPARATUS