Chris Chung

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate having undercut portion for stress mitigation
- Patent number 12,113,032
- Issue date Oct 8, 2024
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress mitigation structure
- Patent number 11,276,650
- Issue date Mar 15, 2022
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with internal wire fence shielding
- Patent number 10,021,790
- Issue date Jul 10, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with thermal via
- Patent number 9,693,445
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for printed circuit board and semiconductor chip packag...
- Patent number 9,192,048
- Issue date Nov 17, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device test socket
- Patent number 9,151,778
- Issue date Oct 6, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- G01 - MEASURING TESTING
Information Patent Grant
Electromagnetic interference blocking device and circuit assembly i...
- Patent number 9,072,168
- Issue date Jun 30, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB loading apparatus for measuring thickness of printed circuit bo...
- Patent number 9,062,968
- Issue date Jun 23, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
STRESS MITIGATION STRUCTURE
- Publication number 20220165685
- Publication date May 26, 2022
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS MITIGATION STRUCTURE
- Publication number 20210134735
- Publication date May 6, 2021
- Avago Technologies International Sales Pte. Limited
- YongIk Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE PASSIVE COMPONENTS AND DEVICES AND PACKAGES INCLUDING T...
- Publication number 20210098192
- Publication date Apr 1, 2021
- Avago Technologies International Sales Pte. Limited
- Michael Howard Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE WITH INTERNAL WIRE FENCE SHIELDING
- Publication number 20170251576
- Publication date Aug 31, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH THERMAL VIA
- Publication number 20160227641
- Publication date Aug 4, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING
- Publication number 20160204077
- Publication date Jul 14, 2016
- Avago Technologies General IP (Singapore) PTE. LTD.
- Hyun Mo Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR TESTING ELECTRONIC DEVICE, AND NOISE BLOCK...
- Publication number 20150207575
- Publication date Jul 23, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR SELECTING OPTIMAL MANUFACTURING PROCESS FOR PRODUCING PR...
- Publication number 20150082616
- Publication date Mar 26, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB LOADING APPARATUS FOR MEASURING THICKNESS OF PRINTED CIRCUIT BO...
- Publication number 20150027240
- Publication date Jan 29, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE TEST SOCKET
- Publication number 20140347082
- Publication date Nov 27, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin JEONG
- G01 - MEASURING TESTING
Information Patent Application
ELECTROMAGNETIC INTERFERENCE BLOCKING DEVICE AND CIRCUIT ASSEMBLY I...
- Publication number 20140340863
- Publication date Nov 20, 2014
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MEASURING THICKNESS OF LAYER IN PRINTED CI...
- Publication number 20140333329
- Publication date Nov 13, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin JEONG
- G01 - MEASURING TESTING
Information Patent Application
TEST SOCKET PROVIDING MECHANICAL STABILIZATION FOR POGO PIN CONNECT...
- Publication number 20140327462
- Publication date Nov 6, 2014
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin JEONG
- G01 - MEASURING TESTING

Chris Chung

Person

Patents Grantslast 30 patents

Substrate having undercut portion for stress mitigation

Stress mitigation structure

Module with internal wire fence shielding

Printed circuit board with thermal via

Bonding pad for printed circuit board and semiconductor chip packag...

Semiconductor device test socket

Electromagnetic interference blocking device and circuit assembly i...

PCB loading apparatus for measuring thickness of printed circuit bo...

Patents Applicationslast 30 patents

STRESS MITIGATION STRUCTURE

STRESS MITIGATION STRUCTURE

LOW PROFILE PASSIVE COMPONENTS AND DEVICES AND PACKAGES INCLUDING T...

MODULE WITH INTERNAL WIRE FENCE SHIELDING

PRINTED CIRCUIT BOARD WITH THERMAL VIA

METHOD FOR MANUFACTURING ELECTRONIC DEVICE BY USING FLIP-CHIP BONDING

APPARATUS AND METHOD FOR TESTING ELECTRONIC DEVICE, AND NOISE BLOCK...

METHOD FOR SELECTING OPTIMAL MANUFACTURING PROCESS FOR PRODUCING PR...

PCB LOADING APPARATUS FOR MEASURING THICKNESS OF PRINTED CIRCUIT BO...

SEMICONDUCTOR DEVICE TEST SOCKET

ELECTROMAGNETIC INTERFERENCE BLOCKING DEVICE AND CIRCUIT ASSEMBLY I...

METHOD AND APPARATUS FOR MEASURING THICKNESS OF LAYER IN PRINTED CI...

TEST SOCKET PROVIDING MECHANICAL STABILIZATION FOR POGO PIN CONNECT...