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Christian Andrada
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Morgan Hill, CA, US
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last 30 patents
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Patent Grant
Air cavity package with copper heat sink and ceramic window frame
Patent number
8,013,429
Issue date
Sep 6, 2011
Infineon Technologies AG
Anwar A. Mohammed
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Air Cavity Package with Copper Heat Sink and Ceramic Window Frame
Publication number
20110012254
Publication date
Jan 20, 2011
Infineon Technologies North America Corp.
Anwar A. Mohammed
H01 - BASIC ELECTRIC ELEMENTS