Christian Bauer

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method and transmission device for data transmission between two or...
- Patent number 11,991,146
- Issue date May 21, 2024
- SIEMENS MOBILITY GMBH
- Christian Bauer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and transmission apparatus for transmitting data between two...
- Patent number 11,411,916
- Issue date Aug 9, 2022
- SIEMENS MOBILITY GMBH
- Christian Bauer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electric component with sensitive component structures and method f...
- Patent number 11,245,977
- Issue date Feb 8, 2022
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Motor vehicle
- Patent number 10,759,341
- Issue date Sep 1, 2020
- Bayerische Motoren Werke Aktiengesellschaft
- Christian Bauer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interior lighting of a motor vehicle
- Patent number 10,322,670
- Issue date Jun 18, 2019
- Bayerische Motoren Werke Aktiengesellschaft
- Michael Mueller
- B60 - VEHICLES IN GENERAL
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 10,164,166
- Issue date Dec 25, 2018
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for encapsulating MEMS components
- Patent number 9,853,204
- Issue date Dec 26, 2017
- Snaptrack, Inc.
- Hans Krüger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package and method for production thereof
- Patent number 9,647,196
- Issue date May 9, 2017
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component and method for producing a component
- Patent number 9,382,110
- Issue date Jul 5, 2016
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation of an MEMS component and a method for producing said...
- Patent number 9,006,868
- Issue date Apr 14, 2015
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed housing for electronic components and manufactu...
- Patent number 8,759,677
- Issue date Jun 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical Component
- Patent number 8,558,356
- Issue date Oct 15, 2013
- EPCOS AG
- Juergen Kiwitt
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing a MEMS package
- Patent number 8,404,516
- Issue date Mar 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for production
- Patent number 8,110,962
- Issue date Feb 7, 2012
- EPCOS AG
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip-chip component production method
- Patent number 7,673,386
- Issue date Mar 9, 2010
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electrical component and production method
- Patent number 7,544,540
- Issue date Jun 9, 2009
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND TRANSMISSION DEVICE FOR DATA TRANSMISSION BETWEEN TWO OR...
- Publication number 20220360558
- Publication date Nov 10, 2022
- Siemens Mobility GmbH
- Christian Bauer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND TRANSMISSION APPARATUS FOR TRANSMITTING DATA BETWEEN TWO...
- Publication number 20200304465
- Publication date Sep 24, 2020
- SIEMENS MOBILITY GMBH
- Christian Bauer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Motor Vehicle
- Publication number 20190135173
- Publication date May 9, 2019
- Bayerische Motoren Werke Aktiengesellschaft
- Christian BAUER
- B60 - VEHICLES IN GENERAL
Information Patent Application
Motor Vehicle
- Publication number 20180222383
- Publication date Aug 9, 2018
- Bayerische Motoren Werke Aktiengesellschaft
- Michael MUELLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS
- Publication number 20180097172
- Publication date Apr 5, 2018
- SnapTrack, Inc.
- Hans KRÜGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...
- Publication number 20170272855
- Publication date Sep 21, 2017
- SnapTrack, Inc.
- Christian BAUER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS Component and Method for Encapsulating MEMS Components
- Publication number 20150325780
- Publication date Nov 12, 2015
- EPCOS AG
- Hans Krüger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component and Method for Producing a Component
- Publication number 20140226285
- Publication date Aug 14, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-Level Package and Method for Production Thereof
- Publication number 20140111062
- Publication date Apr 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...
- Publication number 20130341773
- Publication date Dec 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component and Method for Producing a Component
- Publication number 20130214405
- Publication date Aug 22, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...
- Publication number 20110114355
- Publication date May 19, 2011
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Component and Method for Production
- Publication number 20100148285
- Publication date Jun 17, 2010
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Producing a MEMS Package
- Publication number 20100127377
- Publication date May 27, 2010
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrical Component
- Publication number 20100091473
- Publication date Apr 15, 2010
- Juergen Kiwitt
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Flip-Chip Component and Method for its Production
- Publication number 20090071710
- Publication date Mar 19, 2009
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Electrical Component and Production Method
- Publication number 20070222056
- Publication date Sep 27, 2007
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Christian Bauer

Person

Patents Grantslast 30 patents

Method and transmission device for data transmission between two or...

Method and transmission apparatus for transmitting data between two...

Electric component with sensitive component structures and method f...

Motor vehicle

Interior lighting of a motor vehicle

MEMS component and method for encapsulating MEMS components

MEMS component and method for encapsulating MEMS components

Wafer-level package and method for production thereof

Component and method for producing a component

Encapsulation of an MEMS component and a method for producing said...

Hermetically sealed housing for electronic components and manufactu...

Electrical Component

Method for producing a MEMS package

MEMS component and method for production

Flip-chip component production method

Encapsulated electrical component and production method

Patents Applicationslast 30 patents

METHOD AND TRANSMISSION DEVICE FOR DATA TRANSMISSION BETWEEN TWO OR...

METHOD AND TRANSMISSION APPARATUS FOR TRANSMITTING DATA BETWEEN TWO...

Motor Vehicle

Motor Vehicle

MEMS COMPONENT AND METHOD FOR ENCAPSULATING MEMS COMPONENTS

SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...

MEMS Component and Method for Encapsulating MEMS Components

Component and Method for Producing a Component

Wafer-Level Package and Method for Production Thereof

ENCAPSULATION OF AN MEMS COMPONENT AND A METHOD FOR PRODUCING SAID...

Component and Method for Producing a Component

HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...

MEMS Component and Method for Production

Method for Producing a MEMS Package

Electrical Component

Flip-Chip Component and Method for its Production

Encapsulated Electrical Component and Production Method