Christian Bergeron

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Granby, CA

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Patents Grantslast 30 patents

Information Patent Grant
Mixed under bump metallurgy (UBM) interconnect bridge structure
- Patent number 11,139,269
- Issue date Oct 5, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure
- Publication number 20210233892
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS