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Christian Birzer
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Burglengenfeld, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method
Patent number
9,123,544
Issue date
Sep 1, 2015
Infineon Technologies AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a chip stack on a rewiring plate
Patent number
7,521,809
Issue date
Apr 21, 2009
Infineon Technologies AG
Christian Birzer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor component with electromagnetic shielding device
Patent number
7,009,288
Issue date
Mar 7, 2006
Infineon Technologies AG
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module with a semiconductor chip which has flexible chip...
Patent number
6,940,156
Issue date
Sep 6, 2005
Infineon Technologies AG
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method
Publication number
20130099383
Publication date
Apr 25, 2013
INFINEON TECHNOLOGIES AG
Georg Meyer-Berg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Having a Chip Stack on a Rewiring Plate
Publication number
20070262467
Publication date
Nov 15, 2007
Christian Birzer
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Electronic component and electronic configuration
Publication number
20070018308
Publication date
Jan 25, 2007
Albert Schott
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic component with cavity fillers made from thermoplast and...
Publication number
20060088954
Publication date
Apr 27, 2006
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor component with electromagnetic shielding device
Publication number
20050077596
Publication date
Apr 14, 2005
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic module with a semiconductor chip which has flexible chip...
Publication number
20040075172
Publication date
Apr 22, 2004
Michael Bauer
H01 - BASIC ELECTRIC ELEMENTS