Christian Fachmann

Person

Fuernitz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-die-package and method
- Patent number 12,014,973
- Issue date Jun 18, 2024
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an insulation layer in a semiconductor body and...
- Patent number 11,869,966
- Issue date Jan 9, 2024
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor oxide or glass based connection body with wiring stru...
- Patent number 11,527,468
- Issue date Dec 13, 2022
- Infineon Technologies AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,508,841
- Issue date Nov 22, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a superjunction semiconductor device
- Patent number 11,329,126
- Issue date May 10, 2022
- Infineon Technologies Austria AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an insulation layer in a semiconductor body and...
- Patent number 11,211,483
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power relay circuit
- Patent number 11,139,125
- Issue date Oct 5, 2021
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for operating a superjunction transistor device
- Patent number 11,088,275
- Issue date Aug 10, 2021
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die-package and method
- Patent number 11,081,430
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor device with gate resistor
- Patent number 10,811,529
- Issue date Oct 20, 2020
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge compensation semiconductor devices
- Patent number 10,651,271
- Issue date May 12, 2020
- Infineon Technologies Austria AG
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a first through contact structure in oh...
- Patent number 10,411,126
- Issue date Sep 10, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect semiconductor device having N and P-doped pillar regions
- Patent number 10,374,032
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction semiconductor device having a superstructure
- Patent number 10,224,394
- Issue date Mar 5, 2019
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge compensation semiconductor devices
- Patent number 10,157,982
- Issue date Dec 18, 2018
- Infineon Technologies Austria AG
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing superjunction semiconductor devices with a...
- Patent number 9,905,639
- Issue date Feb 27, 2018
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top side cooling heat sink thermal pathway
- Patent number 9,812,373
- Issue date Nov 7, 2017
- Infineon Technologies AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Intermediate layer for copper structuring and methods of formation...
- Patent number 9,773,736
- Issue date Sep 26, 2017
- Infineon Technologies AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having switchable regions with different trans...
- Patent number 9,679,895
- Issue date Jun 13, 2017
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor switching device with diff...
- Patent number 9,583,395
- Issue date Feb 28, 2017
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer arrangement
- Patent number 9,349,794
- Issue date May 24, 2016
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switching device with different local threshold voltage
- Patent number 9,349,795
- Issue date May 24, 2016
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switching devices with different local transconductance
- Patent number 9,293,533
- Issue date Mar 22, 2016
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor switching device with different local cell geometry
- Patent number 9,231,049
- Issue date Jan 5, 2016
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a layer arrangement, and a layer arrangement
- Patent number 8,772,948
- Issue date Jul 8, 2014
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,097,944
- Issue date Jan 17, 2012
- Infineon Technologies AG
- Stefan Landau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR OPERATING A POWER TRANSISTOR CIRCUIT
- Publication number 20230344422
- Publication date Oct 26, 2023
- Infineon Technologies Austria AG
- Christian Fachmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Power Semiconductor Device
- Publication number 20230268255
- Publication date Aug 24, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20230238333
- Publication date Jul 27, 2023
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICOND...
- Publication number 20230238294
- Publication date Jul 27, 2023
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Chips having a Side Wall Sealing
- Publication number 20220352048
- Publication date Nov 3, 2022
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming an Insulation Layer in a Semiconductor Body and...
- Publication number 20220077309
- Publication date Mar 10, 2022
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE
- Publication number 20220028699
- Publication date Jan 27, 2022
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Relay Circuit
- Publication number 20210407746
- Publication date Dec 30, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die-Package and Method
- Publication number 20210335696
- Publication date Oct 28, 2021
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20200388703
- Publication date Dec 10, 2020
- Franz Hirler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Operating a Superjunction Transistor Device
- Publication number 20200287535
- Publication date Sep 10, 2020
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Relay Circuit
- Publication number 20200161062
- Publication date May 21, 2020
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming an Insulation Layer in a Semiconductor Body and...
- Publication number 20200105918
- Publication date Apr 2, 2020
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...
- Publication number 20200091058
- Publication date Mar 19, 2020
- INFINEON TECHNOLOGIES AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor Device with Gate Resistor
- Publication number 20190319124
- Publication date Oct 17, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die-Package and Method
- Publication number 20190157191
- Publication date May 23, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge Compensation Semiconductor Devices
- Publication number 20190123137
- Publication date Apr 25, 2019
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
- Publication number 20190051742
- Publication date Feb 14, 2019
- Infineon Technologies Austria AG
- Andreas Riegler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Superjunction Semiconductor Device
- Publication number 20180374919
- Publication date Dec 27, 2018
- Infineon Technologies Austria AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field-Effect Semiconductor Device and a Manufacturing Method Therefor
- Publication number 20180294333
- Publication date Oct 11, 2018
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Semiconductor Device Having a Superstructure
- Publication number 20180158901
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge Compensation Semiconductor Devices
- Publication number 20180061937
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Superjunction Semiconductor Devices with a...
- Publication number 20170154956
- Publication date Jun 1, 2017
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Intermediate Layer for Copper Structuring and Methods of Formation...
- Publication number 20160218033
- Publication date Jul 28, 2016
- INFINEON TECHNOLOGIES AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Switchable Regions with Different Trans...
- Publication number 20160190125
- Publication date Jun 30, 2016
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...
- Publication number 20160163616
- Publication date Jun 9, 2016
- INFINEON TECHNOLOGIES AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method for Manufacturing a Semiconductor Switching Device with Diff...
- Publication number 20160099180
- Publication date Apr 7, 2016
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Switching Device with Different Local Threshold Voltage
- Publication number 20150372086
- Publication date Dec 24, 2015
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Switching Device with Different Local Cell Geometry
- Publication number 20150372076
- Publication date Dec 24, 2015
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Switching Devices with Different Local Transconductance
- Publication number 20150372087
- Publication date Dec 24, 2015
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS

Christian Fachmann

Person

Patents Grantslast 30 patents

Multi-die-package and method

Method for forming an insulation layer in a semiconductor body and...

Semiconductor oxide or glass based connection body with wiring stru...

Semiconductor device

Method of manufacturing a superjunction semiconductor device

Method for forming an insulation layer in a semiconductor body and...

Power relay circuit

Method for operating a superjunction transistor device

Multi-die-package and method

Transistor device with gate resistor

Charge compensation semiconductor devices

Semiconductor device having a first through contact structure in oh...

Field-effect semiconductor device having N and P-doped pillar regions

Superjunction semiconductor device having a superstructure

Charge compensation semiconductor devices

Method of manufacturing superjunction semiconductor devices with a...

Semiconductor package with top side cooling heat sink thermal pathway

Intermediate layer for copper structuring and methods of formation...

Semiconductor device having switchable regions with different trans...

Method for manufacturing a semiconductor switching device with diff...

Layer arrangement

Semiconductor switching device with different local threshold voltage

Semiconductor switching devices with different local transconductance

Semiconductor switching device with different local cell geometry

Method for manufacturing a layer arrangement, and a layer arrangement

Semiconductor device

Patents Applicationslast 30 patents

METHOD FOR OPERATING A POWER TRANSISTOR CIRCUIT

Power Semiconductor Device

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING A CHIP-SUBSTRATE COMPOSITE SEMICOND...

Method of Manufacturing Semiconductor Chips having a Side Wall Sealing

Method for Forming an Insulation Layer in a Semiconductor Body and...

CHIP-SUBSTRATE COMPOSITE SEMICONDUCTOR DEVICE

Power Relay Circuit

Multi-Die-Package and Method

Semiconductor Device

Method for Operating a Superjunction Transistor Device

Power Relay Circuit

Method for Forming an Insulation Layer in a Semiconductor Body and...

Semiconductor Oxide or Glass Based Connection Body with Wiring Stru...

Transistor Device with Gate Resistor

Multi-Die-Package and Method

Charge Compensation Semiconductor Devices

Field-Effect Semiconductor Device and a Manufacturing Method Therefor

Method of Manufacturing a Superjunction Semiconductor Device

Field-Effect Semiconductor Device and a Manufacturing Method Therefor

Superjunction Semiconductor Device Having a Superstructure

Charge Compensation Semiconductor Devices

Method of Manufacturing Superjunction Semiconductor Devices with a...

Intermediate Layer for Copper Structuring and Methods of Formation...

Semiconductor Device Having Switchable Regions with Different Trans...

Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...

Method for Manufacturing a Semiconductor Switching Device with Diff...

Semiconductor Switching Device with Different Local Threshold Voltage

Semiconductor Switching Device with Different Local Cell Geometry

Semiconductor Switching Devices with Different Local Transconductance