Christian Goebl

Person

Nurnberg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Connecting mechanism arrangeable to a photovoltaic module
- Patent number 9,013,065
- Issue date Apr 21, 2015
- Semikron GmbH & Co., KG
- Marian Mateicka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor arrangement
- Patent number 8,564,126
- Issue date Oct 22, 2013
- Semikron Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with a hermetically tight circuit arrang...
- Patent number 8,324,717
- Issue date Dec 4, 2012
- Semikron Elektronik GmbH & Co., KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor component with metal contact layer and producti...
- Patent number 8,110,925
- Issue date Feb 7, 2012
- Semikron Elektronik GmbH & Co., KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 7,638,872
- Issue date Dec 29, 2009
- Semikron Elektronik GmbH & Co. KG
- Christian Goebl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit arrangement with a cooling member
- Patent number 5,296,739
- Issue date Mar 22, 1994
- Export-Contor Aussenhandelsgesellschaft mbH
- Heinrich Heilbronner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Connecting Mechanism Arrangeable To A Photovoltaic Module
- Publication number 20120025617
- Publication date Feb 2, 2012
- SEMIKRON Electronik GmbH & Co. KG
- Marian MATEICKA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Arrangement
- Publication number 20100264537
- Publication date Oct 21, 2010
- SEMIKRON Elektronik GmbH & Co. KG
- Christian GOEBL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module with a hermetically tight circuit arrang...
- Publication number 20100090328
- Publication date Apr 15, 2010
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting structure for connecting at least one semiconductor com...
- Publication number 20090096083
- Publication date Apr 16, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Karlheinz Augustin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor component with metal contact layer and producti...
- Publication number 20090039516
- Publication date Feb 12, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power semiconductor module
- Publication number 20070102796
- Publication date May 10, 2007
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic welding head
- Publication number 20070102489
- Publication date May 10, 2007
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit device in particular frequency converter
- Publication number 20070104926
- Publication date May 10, 2007
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Goebl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Christian Goebl

Person

Patents Grantslast 30 patents

Connecting mechanism arrangeable to a photovoltaic module

Semiconductor arrangement

Power semiconductor module with a hermetically tight circuit arrang...

Power semiconductor component with metal contact layer and producti...

Power semiconductor module

Circuit arrangement with a cooling member

Patents Applicationslast 30 patents

Connecting Mechanism Arrangeable To A Photovoltaic Module

Semiconductor Arrangement

Power semiconductor module with a hermetically tight circuit arrang...

Connecting structure for connecting at least one semiconductor com...

Power semiconductor component with metal contact layer and producti...

Power semiconductor module

Ultrasonic welding head

Circuit device in particular frequency converter