Christian Goetze

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Chip module with robust in-package interconnects
- Patent number 11,804,440
- Issue date Oct 31, 2023
- GLOBALFOUNDRIES U.S. INC.
- Saquib B. Halim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging with integrated antenna structures
- Patent number 10,580,745
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Marcel Wieland
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP MODULE WITH ROBUST IN-PACKAGE INTERCONNECTS
- Publication number 20220238448
- Publication date Jul 28, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Saquib B. Halim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING WITH INTEGRATED ANTENNA STRUCTURES
- Publication number 20200075513
- Publication date Mar 5, 2020
- GLOBALFOUNDRIES INC.
- Marcel Wieland
- H01 - BASIC ELECTRIC ELEMENTS