Christian JOOS

Person

Ehrenkirchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor component with cap over trench and sensor elements
- Patent number 10,693,057
- Issue date Jun 23, 2020
- TDK-MICRONAS GMBH
- Marc Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component with reduced stress forces in the substrate
- Patent number 10,103,320
- Issue date Oct 16, 2018
- TDK-MICRONAS GMBH
- Marc Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a leadframe
- Patent number 9,620,391
- Issue date Apr 11, 2017
- Micronas GmbH
- Wolfgang Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing and method for the production of a semiconduc...
- Patent number 8,822,253
- Issue date Sep 2, 2014
- Micronas GmbH
- Tobias Kolleth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor housing and method for the production of a semiconduc...
- Patent number 8,604,599
- Issue date Dec 10, 2013
- Micronas GmbH
- Tobias Kolleth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of SMD components in an IC housing
- Patent number 8,203,168
- Issue date Jun 19, 2012
- Micronas GmbH
- Felix Schinner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE
- Publication number 20180233658
- Publication date Aug 16, 2018
- TDK - Micronas GmbH
- Marc Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE
- Publication number 20170324028
- Publication date Nov 9, 2017
- Micronas GmbH
- Marc Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH A LEADFRAME
- Publication number 20160035594
- Publication date Feb 4, 2016
- Micronas GmbH
- Wolfgang HAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUC...
- Publication number 20140057395
- Publication date Feb 27, 2014
- Micronas GmbH
- Tobias KOLLETH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUC...
- Publication number 20120228756
- Publication date Sep 13, 2012
- Tobias KOLLETH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING
- Publication number 20110068460
- Publication date Mar 24, 2011
- Felix SCHINNER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
An electronic component with a leadframe
- Publication number 20040113240
- Publication date Jun 17, 2004
- Wolfgang Hauser
- H01 - BASIC ELECTRIC ELEMENTS

Christian JOOS

Person

Patents Grantslast 30 patents

Sensor component with cap over trench and sensor elements

Component with reduced stress forces in the substrate

Electronic component with a leadframe

Semiconductor housing and method for the production of a semiconduc...

Semiconductor housing and method for the production of a semiconduc...

Integration of SMD components in an IC housing

Patents Applicationslast 30 patents

COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE

COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE

ELECTRONIC COMPONENT WITH A LEADFRAME

SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUC...

SEMICONDUCTOR HOUSING AND METHOD FOR THE PRODUCTION OF A SEMICONDUC...

INTEGRATION OF SMD COMPONENTS IN AN IC HOUSING

An electronic component with a leadframe