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Christian Kersting
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Paderborn, DE
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last 30 patents
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Patent Grant
Semiconductor module bonding wire connection method
Patent number
9,925,588
Issue date
Mar 27, 2018
Infineon Technologies AG
Daniel Bolowski
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
Publication number
20150333034
Publication date
Nov 19, 2015
INFINEON TECHNOLOGIES AG
Daniel Bolowski
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR