Christian Maier

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with first and second portions that include si...
- Patent number 11,804,415
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with a portion including silicon and nitrogen...
- Patent number 11,075,134
- Issue date Jul 27, 2021
- Infineon Technologies AG
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer releasing
- Patent number 10,186,445
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Mathias Male
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for processing a semiconductor layer, method for processing...
- Patent number 9,941,111
- Issue date Apr 10, 2018
- Infineon Technologies AG
- Gerhard Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer releasing
- Patent number 9,410,249
- Issue date Aug 9, 2016
- Infineon Technologies AG
- Mathias Male
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method, apparatus for holding and treatment of a substrate
- Patent number 8,857,805
- Issue date Oct 14, 2014
- Infineon Technologies AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus for holding and treatment of a substrate
- Patent number 8,822,310
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Gerald Lackner
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...
- Publication number 20210287954
- Publication date Sep 16, 2021
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device with a Portion Including Silicon and Nitrogen...
- Publication number 20200083133
- Publication date Mar 12, 2020
- Markus Kahn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Device and Manufacturing
- Publication number 20190333765
- Publication date Oct 31, 2019
- Markus Kahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR LAYER, METHOD FOR PROCESSING...
- Publication number 20160351413
- Publication date Dec 1, 2016
- INFINEON TECHNOLOGIES AG
- Gerhard SCHMIDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Releasing
- Publication number 20160322250
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES AG
- Mathias Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Releasing
- Publication number 20150332951
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20130164939
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20090004824
- Publication date Jan 1, 2009
- INFINEON TECHNOLOGIES AG
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE
- Publication number 20080064184
- Publication date Mar 13, 2008
- Infineon Technologies AGAM CAMPEON
- Gerald Lackner
- H01 - BASIC ELECTRIC ELEMENTS

Christian Maier

Person

Patents Grantslast 30 patents

Semiconductor device with first and second portions that include si...

Semiconductor device with a portion including silicon and nitrogen...

Wafer releasing

Method for processing a semiconductor layer, method for processing...

Wafer releasing

Method, apparatus for holding and treatment of a substrate

Method, apparatus for holding and treatment of a substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH FIRST AND SECOND PORTIONS THAT INCLUDE SI...

Semiconductor Device with a Portion Including Silicon and Nitrogen...

Semiconductor Device and Manufacturing

METHOD FOR PROCESSING A SEMICONDUCTOR LAYER, METHOD FOR PROCESSING...

Wafer Releasing

Wafer Releasing

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE

METHOD, APPARATUS FOR HOLDING AND TREATMENT OF A SUBSTRATE