Christian Neugirg

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having a thermally and electrically conductiv...
- Patent number 12,224,222
- Issue date Feb 11, 2025
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with power electronics carrier having trench...
- Patent number 12,183,667
- Issue date Dec 31, 2024
- Infineon Technologies AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,682,611
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Michael Niendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising substrate, semiconductor chip...
- Patent number 11,631,628
- Issue date Apr 18, 2023
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module comprising two substrates and method of manufacturing...
- Patent number 11,574,889
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Ottmar Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package comprising a leadframe connected to a su...
- Patent number 11,037,856
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE
- Publication number 20230411254
- Publication date Dec 21, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...
- Publication number 20230245968
- Publication date Aug 3, 2023
- INFINEON TECHNOLOGIES AG
- Peter Scherl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...
- Publication number 20230223312
- Publication date Jul 13, 2023
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20210398887
- Publication date Dec 23, 2021
- Michael Niendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20210193556
- Publication date Jun 24, 2021
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20200251400
- Publication date Aug 6, 2020
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...
- Publication number 20190103342
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170154835
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150264796
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power module comprising two substrates and method of manufacturing...
- Publication number 20140353818
- Publication date Dec 4, 2014
- Ottmar GEITNER
- H01 - BASIC ELECTRIC ELEMENTS

Christian Neugirg

Person

Patents Grantslast 30 patents

Semiconductor package having a thermally and electrically conductiv...

Semiconductor package with power electronics carrier having trench...

Power semiconductor module

Semiconductor chip package comprising substrate, semiconductor chip...

Power module comprising two substrates and method of manufacturing...

Semiconductor chip package comprising a leadframe connected to a su...

Electronic module and method of manufacturing the same

Patents Applicationslast 30 patents

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

SEMICONDUCTOR PACKAGE WITH POWER ELECTRONICS CARRIER HAVING TRENCH...

SEMICONDUCTOR PACKAGE HAVING A THERMALLY AND ELECTRICALLY CONDUCTIV...

Power Semiconductor Module

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP...

Electronic module and method of manufacturing the same

Electronic module and method of manufacturing the same

Power module comprising two substrates and method of manufacturing...