Christian Stahlhut

Person

Rinteln, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a passivation structure and manufact...
- Patent number 11,211,303
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bending a substrate
- Patent number 10,600,658
- Issue date Mar 24, 2020
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor substrate
- Patent number 10,475,668
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting a semiconductor chip metal surface of a subst...
- Patent number 9,978,711
- Issue date May 22, 2018
- Infineon Technologies AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module bonding wire connection method
- Patent number 9,925,588
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION STRUCTURE AND MANUFACT...
- Publication number 20200185297
- Publication date Jun 11, 2020
- INFINEON TECHNOLOGIES AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Bending a Substrate
- Publication number 20200027752
- Publication date Jan 23, 2020
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Processing a Semiconductor Substrate
- Publication number 20190006193
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Connecting a Semiconductor Chip Metal Surface of a Subst...
- Publication number 20170170143
- Publication date Jun 15, 2017
- INFINEON TECHNOLOGIES AG
- Gopalakrishnan Trichy Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
- Publication number 20150333034
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Daniel Bolowski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SI...
- Publication number 20150257280
- Publication date Sep 10, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Ciliox
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Christian Stahlhut

Person

Patents Grantslast 30 patents

Semiconductor device including a passivation structure and manufact...

Apparatus and method for bending a substrate

Apparatus and method for processing a semiconductor substrate

Method for connecting a semiconductor chip metal surface of a subst...

Semiconductor module bonding wire connection method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING A PASSIVATION STRUCTURE AND MANUFACT...

Apparatus and Method for Bending a Substrate

Apparatus and Method for Processing a Semiconductor Substrate

Method for Connecting a Semiconductor Chip Metal Surface of a Subst...

SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD

METHOD FOR PRODUCING A DRIED PASTE LAYER, METHOD FOR PRODUCING A SI...