Christian Steininger

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Soest, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with pressed baseplate and method for pr...
- Patent number 9,000,580
- Issue date Apr 7, 2015
- Infineon Technologies AG
- Torsten Groening
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE
- Publication number 20230360982
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Martin Goldammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Terminal Element or Bus Bar, and Power Semiconductor Module Arrange...
- Publication number 20230170286
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Material-Bonding Connection between a Semico...
- Publication number 20160148819
- Publication date May 26, 2016
- INFINEON TECHNOLOGIES AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Pressed Baseplate and Method for Pr...
- Publication number 20130193591
- Publication date Aug 1, 2013
- INFINEON TECHNOLOGIES AG
- Torsten Groening
- H01 - BASIC ELECTRIC ELEMENTS