Christian Stuempfl

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Schmidgaden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Selective plating of semiconductor package leads
- Patent number 10,651,109
- Issue date May 12, 2020
- Infineon Technologies AG
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020607
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS