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Christian Zistl
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Dresden, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including a hybrid metallization layer stack f...
Patent number
8,698,312
Issue date
Apr 15, 2014
GLOBALFOUNDRIES Inc.
James Werking
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resist trim process to define small openings in dielectric layers
Patent number
7,737,021
Issue date
Jun 15, 2010
Globalfoundries Inc.
Srikanteswara Dakshina-Murthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of patterning a low-k dielectric using a hard mask
Patent number
7,416,992
Issue date
Aug 26, 2008
Advanced Micro Devices, Inc.
Matthias Lehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Simultaneous formation of device and backside contacts on wafers ha...
Patent number
7,005,380
Issue date
Feb 28, 2006
Advanced Micro Devices, Inc.
Massud Aminpur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Depth of focus (DOF) for trench-first-via-last (TFVL) damascene pro...
Patent number
6,881,665
Issue date
Apr 19, 2005
Advanced Micro Devices, Inc.
Ting Yiu Tsui
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a copper line having an increased resista...
Patent number
6,806,191
Issue date
Oct 19, 2004
Advanced Micro Devices, Inc.
Christian Zistl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resist trim process to define small openings in dielectric layers
Patent number
6,500,755
Issue date
Dec 31, 2002
Advanced Micro Devices, Inc.
Srikanteswara Dakshina-Murthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of defining small openings in dielectric layers
Patent number
6,406,993
Issue date
Jun 18, 2002
Advanced Micro Devices, Inc.
Srikanteswara Dakshina-Murthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with partial passivation layer
Patent number
6,313,538
Issue date
Nov 6, 2001
Advanced Micro Devices, Inc.
Christian Zistl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a semiconductor device with metal silicide regions
Patent number
6,268,255
Issue date
Jul 31, 2001
Advanced Micro Devices, Inc.
Paul R. Besser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reverse electroplating of barrier metal layer to improve electromig...
Patent number
6,261,963
Issue date
Jul 17, 2001
Advanced Micro Devices, Inc.
Larry Zhao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method of patterning a low-k dielectric using a hard mask
Publication number
20060246711
Publication date
Nov 2, 2006
Matthias Lehr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device including a hybrid metallization layer stack f...
Publication number
20050242435
Publication date
Nov 3, 2005
James Werking
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Simultaneous formation of device and backside contacts on wafers ha...
Publication number
20040121599
Publication date
Jun 24, 2004
Massud Aminpur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Diffusion barrier layer in semiconductor substrates to reduce coppe...
Publication number
20030232466
Publication date
Dec 18, 2003
Christian Zistl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device with a copper line having an increased resista...
Publication number
20030224599
Publication date
Dec 4, 2003
Christian Zistl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Locally increasing sidewall density by ion implantation
Publication number
20030013296
Publication date
Jan 16, 2003
Eric M. Apelgren
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resist trim process to define small openings in dielectric layers
Publication number
20020068436
Publication date
Jun 6, 2002
Srikanteswara Dakshina-Murthy
H01 - BASIC ELECTRIC ELEMENTS