Christin Bartsch

Person

Lauterbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Reducing copper defects during a wet chemical cleaning of exposed c...
- Patent number 8,673,087
- Issue date Mar 18, 2014
- Advanced Micro Devices, Inc.
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for quantitative inline material characterization...
- Patent number 8,423,320
- Issue date Apr 16, 2013
- Advanced Micro Devices, Inc.
- Matthias Schaller
- G01 - MEASURING TESTING
Information Patent Grant
Method of reducing erosion of a metal cap layer during via patterni...
- Patent number 8,338,293
- Issue date Dec 25, 2012
- Advanced Micro Devies, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing erosion of a metal cap layer during via patterni...
- Patent number 7,986,040
- Issue date Jul 26, 2011
- Advanced Micro Devices, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing contamination by removing an interlayer dielectr...
- Patent number 7,410,885
- Issue date Aug 12, 2008
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming a passivation layer prior to depositing a bar...
- Patent number 7,259,091
- Issue date Aug 21, 2007
- Advanced Micro Devices, Inc.
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...
- Publication number 20120003832
- Publication date Jan 5, 2012
- Advanced Micro Devices, Inc.
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR QUANTITATIVE INLINE MATERIAL CHARACTERIZATION...
- Publication number 20090319196
- Publication date Dec 24, 2009
- Matthias Schaller
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...
- Publication number 20090273086
- Publication date Nov 5, 2009
- Christin Bartsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING COPPER DEFECTS DURING A WET CHEMICAL CLEANING OF EXPOSED C...
- Publication number 20090139543
- Publication date Jun 4, 2009
- Frank Feustel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING CONTAMINATION BY REMOVING AN INTERLAYER DIELECTR...
- Publication number 20070026670
- Publication date Feb 1, 2007
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming electrical connections in a semiconductor structure
- Publication number 20060141775
- Publication date Jun 29, 2006
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming a passivation layer prior to depositing a bar...
- Publication number 20060024951
- Publication date Feb 2, 2006
- Holger Schuehrer
- H01 - BASIC ELECTRIC ELEMENTS

Christin Bartsch

Person

Patents Grantslast 30 patents

Reducing copper defects during a wet chemical cleaning of exposed c...

Method and system for quantitative inline material characterization...

Method of reducing erosion of a metal cap layer during via patterni...

Method of reducing erosion of a metal cap layer during via patterni...

Method of reducing contamination by removing an interlayer dielectr...

Technique for forming a passivation layer prior to depositing a bar...

Patents Applicationslast 30 patents

METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...

METHOD AND SYSTEM FOR QUANTITATIVE INLINE MATERIAL CHARACTERIZATION...

METHOD OF REDUCING EROSION OF A METAL CAP LAYER DURING VIA PATTERNI...

REDUCING COPPER DEFECTS DURING A WET CHEMICAL CLEANING OF EXPOSED C...

METHOD OF REDUCING CONTAMINATION BY REMOVING AN INTERLAYER DIELECTR...

Method of forming electrical connections in a semiconductor structure

Technique for forming a passivation layer prior to depositing a bar...