Christine A. Leggett

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Colchester, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Tsv wafer with improved fracture strength
- Patent number 9,607,929
- Issue date Mar 28, 2017
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a TSV wafer with improved fracture strength
- Patent number 9,312,205
- Issue date Apr 12, 2016
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TSV WAFER WITH IMPROVED FRACTURE STRENGTH
- Publication number 20150348876
- Publication date Dec 3, 2015
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV WAFER FRACTURE STRENGTH
- Publication number 20150255404
- Publication date Sep 10, 2015
- International Business Machines Corporation
- James W. Adkisson
- H01 - BASIC ELECTRIC ELEMENTS