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Christine Blair
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Lewisville, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
System in package with flip chip die over multi-layer heatsink stan...
Patent number
11,942,391
Issue date
Mar 26, 2024
Qorvo US, Inc.
Kelly M. Lear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air-cavity semiconductor package with low cost high thermal carrier
Patent number
10,872,837
Issue date
Dec 22, 2020
Qorvo US, Inc.
Robert Charles Dry
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
Publication number
20240178096
Publication date
May 30, 2024
Qorvo US, Inc.
Kelly M. Lear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN A PACKAGE (SIP) WITH AIR CAVITY AND EPOXY SEAL
Publication number
20230402333
Publication date
Dec 14, 2023
Qorvo US, Inc.
MD Hasnine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP MODULE THERMAL MANAGEMENT THROUGH BACKSIDE METAL
Publication number
20230343721
Publication date
Oct 26, 2023
Qorvo US, Inc.
MD Hasnine
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED HEAT SLUG IN A SUBSTRATE
Publication number
20230317554
Publication date
Oct 5, 2023
Qorvo US, Inc.
Christine Blair
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM IN PACKAGE WITH FLIP CHIP DIE OVER MULTI-LAYER HEATSINK STAN...
Publication number
20230170275
Publication date
Jun 1, 2023
Qorvo US, Inc.
Kelly M. Lear
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AIR-CAVITY SEMICONDUCTOR PACKAGE WITH LOW COST HIGH THERMAL CARRIER
Publication number
20200357716
Publication date
Nov 12, 2020
Qorvo US, Inc.
Robert Charles Dry
H01 - BASIC ELECTRIC ELEMENTS