Christine H. Tsau

Person

Arlington, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sealed MEMS devices with multiple chamber pressures
- Patent number 9,102,512
- Issue date Aug 11, 2015
- Analog Devices, Inc.
- Christine H. Tsau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for forming alignment features for back side p...
- Patent number 9,105,644
- Issue date Aug 11, 2015
- Analog Devices, Inc.
- Christine H. Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,956,904
- Issue date Feb 17, 2015
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of bonding wafers
- Patent number 8,507,913
- Issue date Aug 13, 2013
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced stiction MEMS device with exposed silicon carbide
- Patent number 8,507,306
- Issue date Aug 13, 2013
- Analog Devices, Inc.
- Li Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 8,304,861
- Issue date Nov 6, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of substrate bonding with bonding material having rare Earth...
- Patent number 8,293,582
- Issue date Oct 23, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 8,288,191
- Issue date Oct 16, 2012
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with bonding material having rare earth metal
- Patent number 7,981,765
- Issue date Jul 19, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method of wafer bonding using compatible alloy
- Patent number 7,943,411
- Issue date May 17, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRE...
- Publication number 20240300808
- Publication date Sep 12, 2024
- Analog Devices, Inc.
- Kemiao Jia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sealed MEMS Devices with Multiple Chamber Pressures
- Publication number 20150097253
- Publication date Apr 9, 2015
- Analog Devices, Inc.
- Christine H. Tsau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method for Forming Alignment Features for Back Side P...
- Publication number 20150028499
- Publication date Jan 29, 2015
- Analog Devices, Inc.
- Christine H. Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Creating Asperities in Metal for Metal-to-Metal Bonding
- Publication number 20130288070
- Publication date Oct 31, 2013
- Analog Devices, Inc.
- Christine H. Tsau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20130023082
- Publication date Jan 24, 2013
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Bonding Wafers
- Publication number 20120074417
- Publication date Mar 29, 2012
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Substrate Bonding with Bonding Material Having Rare Earth...
- Publication number 20110244630
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20110241176
- Publication date Oct 6, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20110212563
- Publication date Sep 1, 2011
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reduced Stiction MEMS Device with Exposed Silicon Carbide
- Publication number 20110073859
- Publication date Mar 31, 2011
- Analog Devices, Inc.
- Li Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS D...
- Publication number 20100320548
- Publication date Dec 23, 2010
- Analog Devices, Inc.
- Christine H. Tsau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and Method of Wafer Bonding Using Compatible Alloy
- Publication number 20100059835
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Substrate Bonding with Bonding Material Having Rare Earth Metal
- Publication number 20100062565
- Publication date Mar 11, 2010
- Analog Devices, Inc.
- John R. Martin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Christine H. Tsau

Person

Patents Grantslast 30 patents

Sealed MEMS devices with multiple chamber pressures

Apparatus and method for forming alignment features for back side p...

Apparatus and method of wafer bonding using compatible alloy

Method of bonding wafers

Reduced stiction MEMS device with exposed silicon carbide

Substrate bonding with bonding material having rare earth metal

Method of substrate bonding with bonding material having rare Earth...

Apparatus and method of wafer bonding using compatible alloy

Substrate bonding with bonding material having rare earth metal

Apparatus and method of wafer bonding using compatible alloy

Patents Applicationslast 30 patents

MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRE...

Sealed MEMS Devices with Multiple Chamber Pressures

Apparatus and Method for Forming Alignment Features for Back Side P...

Method for Creating Asperities in Metal for Metal-to-Metal Bonding

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Method of Bonding Wafers

Method of Substrate Bonding with Bonding Material Having Rare Earth...

Substrate Bonding with Bonding Material Having Rare Earth Metal

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Reduced Stiction MEMS Device with Exposed Silicon Carbide

Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS D...

Apparatus and Method of Wafer Bonding Using Compatible Alloy

Substrate Bonding with Bonding Material Having Rare Earth Metal