Christo P. Bojkov

Person

Plano, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency devices with photo-imageable polymers and related m...
- Patent number 12,002,866
- Issue date Jun 4, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging an integrated circuit (IC) package with embedd...
- Patent number 11,929,300
- Issue date Mar 12, 2024
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorinated polymers with low dielectric loss for environmental pro...
- Patent number 11,877,505
- Issue date Jan 16, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MMICs with backside interconnects for fanout-style packaging
- Patent number 11,791,312
- Issue date Oct 17, 2023
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with embedded heat spreader in a re...
- Patent number 11,626,340
- Issue date Apr 11, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for spatial power-combining devices
- Patent number 10,855,240
- Issue date Dec 1, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,832,984
- Issue date Nov 10, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,651,103
- Issue date May 12, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental protection for wafer level and package level applicat...
- Patent number 10,615,091
- Issue date Apr 7, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package integrated circuit incorporating solder balls c...
- Patent number 8,035,226
- Issue date Oct 11, 2011
- Maxim Integrated Products, Inc.
- Duane T. Wilcoxen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bumping on integrated circuit contacts enabled by metal-to-i...
- Patent number 7,271,030
- Issue date Sep 18, 2007
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 7,262,126
- Issue date Aug 28, 2007
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bumping on integrated circuit contacts enabled by metal-to-i...
- Patent number 7,005,752
- Issue date Feb 28, 2006
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for chemical etch control of noble metals in the presence of...
- Patent number 6,979,647
- Issue date Dec 27, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealing and protecting integrated circuit bonding pads
- Patent number 6,927,493
- Issue date Aug 9, 2005
- Texas Instruments Incorporated
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...
- Publication number 20240258197
- Publication date Aug 1, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...
- Publication number 20230207415
- Publication date Jun 29, 2023
- Qorvo US, Inc.
- Kevin J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH PHOTO-IMAGEABLE POLYMERS AND RELATED M...
- Publication number 20230018673
- Publication date Jan 19, 2023
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUORINATED POLYMERS WITH LOW DIELECTRIC LOSS FOR ENVIRONMENTAL PRO...
- Publication number 20220123216
- Publication date Apr 21, 2022
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MMICS WITH BACKSIDE INTERCONNECTS FOR FANOUT-STYLE PACKAGING
- Publication number 20200176416
- Publication date Jun 4, 2020
- Qorvo US, Inc.
- Andrew Arthur Ketterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES
- Publication number 20200162046
- Publication date May 21, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...
- Publication number 20200152533
- Publication date May 14, 2020
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...
- Publication number 20180122716
- Publication date May 3, 2018
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct bumping on integrated circuit contacts enabled by metal-to-i...
- Publication number 20060091541
- Publication date May 4, 2006
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050245076
- Publication date Nov 3, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct bumping on integrated circuit contacts enabled by metal-to-i...
- Publication number 20050082685
- Publication date Apr 21, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing and protecting integrated circuit bonding pads
- Publication number 20050073048
- Publication date Apr 7, 2005
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for chemical etch control of noble metals in the presence of...
- Publication number 20050048798
- Publication date Mar 3, 2005
- Christo P. Bojkov
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20040157450
- Publication date Aug 12, 2004
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for pulse current plating
- Publication number 20040140219
- Publication date Jul 22, 2004
- TEXAS INSTRUMENTS INCORPORATED
- Christo P. Bojkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Waferlevel method for direct bumping on copper pads in integrated c...
- Publication number 20030116845
- Publication date Jun 26, 2003
- Christo P. Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Christo P. Bojkov

Person

Patents Grantslast 30 patents

Radio frequency devices with photo-imageable polymers and related m...

Method for packaging an integrated circuit (IC) package with embedd...

Fluorinated polymers with low dielectric loss for environmental pro...

MMICs with backside interconnects for fanout-style packaging

Integrated circuit (IC) package with embedded heat spreader in a re...

Structures for spatial power-combining devices

Environmental protection for wafer level and package level applicat...

Environmental protection for wafer level and package level applicat...

Environmental protection for wafer level and package level applicat...

Wafer level package integrated circuit incorporating solder balls c...

Direct bumping on integrated circuit contacts enabled by metal-to-i...

Sealing and protecting integrated circuit bonding pads

Direct bumping on integrated circuit contacts enabled by metal-to-i...

Method for chemical etch control of noble metals in the presence of...

Sealing and protecting integrated circuit bonding pads

Patents Applicationslast 30 patents

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

METHODS AND ASSEMBLIES FOR COOLING SEMICONDUCTOR DEVICES USING CARB...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED HEAT SPREADER IN A RE...

RADIO FREQUENCY DEVICES WITH PHOTO-IMAGEABLE POLYMERS AND RELATED M...

FLUORINATED POLYMERS WITH LOW DIELECTRIC LOSS FOR ENVIRONMENTAL PRO...

MMICS WITH BACKSIDE INTERCONNECTS FOR FANOUT-STYLE PACKAGING

STRUCTURES FOR SPATIAL POWER-COMBINING DEVICES

ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...

ENVIRONMENTAL PROTECTION FOR WAFER LEVEL AND PACKAGE LEVEL APPLICAT...

Direct bumping on integrated circuit contacts enabled by metal-to-i...

Sealing and protecting integrated circuit bonding pads

Direct bumping on integrated circuit contacts enabled by metal-to-i...

Sealing and protecting integrated circuit bonding pads

Method for chemical etch control of noble metals in the presence of...

Waferlevel method for direct bumping on copper pads in integrated c...

System and method for pulse current plating

Waferlevel method for direct bumping on copper pads in integrated c...

Micromechanical device contact terminals free of particle generation