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Christof Klos
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Warstein, DE
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last 30 patents
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Patent Grant
Bonding wire and bonded connection
Patent number
7,319,196
Issue date
Jan 15, 2008
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
Guy LeFranc
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
Bonding wire and bonded connection
Publication number
20060055041
Publication date
Mar 16, 2006
Eupec Europaische Gesellschaft fur Leistungshalbleiter mbH
Guy LeFranc
H01 - BASIC ELECTRIC ELEMENTS