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Christof Landesberger
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Muenchen, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Microelectronic arrangement and method for manufacturing the same
Patent number
11,901,285
Issue date
Feb 13, 2024
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer 3D foil package
Patent number
11,570,898
Issue date
Jan 31, 2023
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Christof Landesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing planar thin packages
Patent number
10,752,499
Issue date
Aug 25, 2020
Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
Christof Landesberger
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Device comprising film for electrostatic coupling of a substrate to...
Patent number
10,304,714
Issue date
May 28, 2019
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier wafer, method for holding a flexible substrate and method f...
Patent number
9,978,626
Issue date
May 22, 2018
Fraunhofer Gesellschaft zur Foederung der angewandten Forschung e.V.
Christoph Kutter
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Method of producing a chip package, and chip package
Patent number
8,563,358
Issue date
Oct 22, 2013
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christof Landesberger
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing flexible integrated circuits which may be prov...
Patent number
8,198,135
Issue date
Jun 12, 2012
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Gerhard Klink
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and device for electrostatic fixing of substrates with polar...
Patent number
7,733,624
Issue date
Jun 8, 2010
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mobile holder for a wafer
Patent number
7,027,283
Issue date
Apr 11, 2006
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of subdividing a wafer
Patent number
6,756,288
Issue date
Jun 29, 2004
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Michael Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for handling a plurality of circuit chips
Patent number
6,514,790
Issue date
Feb 4, 2003
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Andreas Plettner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for vertically integrating active circuit planes and vertica...
Patent number
6,444,493
Issue date
Sep 3, 2002
Fraunhofer Gesellschaft zur Foerderung der angewandten Forschung e.V.
Michael Feil
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for joining inorganic substrates in a permanent manner
Patent number
6,328,841
Issue date
Dec 11, 2001
Fraunhofer-Gesellschaft zur Foerderungdder Angewandten Forschung, e.V.
Armin Klumpp
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THREE-DIMENSIONALLY INTEGRATED MULTI-IC SYSTEM WITH INTERCONNECT CO...
Publication number
20240290724
Publication date
Aug 29, 2024
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210375754
Publication date
Dec 2, 2021
Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Module
Publication number
20210234256
Publication date
Jul 29, 2021
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Layer 3D Foil Package
Publication number
20210176864
Publication date
Jun 10, 2021
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for Manufacturing Planar Thin Packages for Semiconductor Dev...
Publication number
20190135618
Publication date
May 9, 2019
Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof LANDESBERGER
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
DEVICE COMPRISING FILM FOR ELECTROSTATIC COUPLING OF A SUBSTRATE TO...
Publication number
20180108557
Publication date
Apr 19, 2018
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNED LAYER COMPOUND
Publication number
20180035548
Publication date
Feb 1, 2018
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Christof LANDESBERGER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CARRIER WAFER, METHOD FOR HOLDING A FLEXIBLE SUBSTRATE AND METHOD F...
Publication number
20160035611
Publication date
Feb 4, 2016
Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
Christoph Kutter
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Application
CARRIER SUBSTRATE AND METHOD FOR FIXING A SUBSTRATE STRUCTURE
Publication number
20150332944
Publication date
Nov 19, 2015
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Christof LANDESBERGER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Producing a Chip Package, and Chip Package
Publication number
20120091594
Publication date
Apr 19, 2012
Christof LANDESBERGER
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROV...
Publication number
20110047793
Publication date
Mar 3, 2011
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
Gerhard KLINK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR THE SELECTIVE COATING OF A SURFACE WITH LIQUID
Publication number
20090162566
Publication date
Jun 25, 2009
Erwin Yacoub-George
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and Device for Electrostatic Fixing of Substrates With Polar...
Publication number
20080232022
Publication date
Sep 25, 2008
Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROV...
Publication number
20080076209
Publication date
Mar 27, 2008
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Gerhard KLINK
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Mobile holder for a wafer
Publication number
20040037692
Publication date
Feb 26, 2004
Christof Landesberger
H01 - BASIC ELECTRIC ELEMENTS