Christof Matthias Schilz

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of assembling a semiconductor package
- Patent number 8,410,586
- Issue date Apr 2, 2013
- Infineon Technologies, AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for producing a device and device
- Patent number 7,811,860
- Issue date Oct 12, 2010
- Infineon Technologies AG
- Joachim Mahler
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package and Method of Assembling a Semiconductor Package
- Publication number 20090065912
- Publication date Mar 12, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING A DEVICE AND DEVICE
- Publication number 20080179760
- Publication date Jul 31, 2008
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...