Christof Streck

Person

Coswig, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits with an insultating layer and methods for produ...
- Patent number 9,443,723
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Ronny Pfutzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for forming a dielectric interlayer above a structure inc...
- Patent number 8,772,178
- Issue date Jul 8, 2014
- GLOBALFOUNDRIES Inc.
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased density of low-K dielectric materials in semiconductor de...
- Patent number 8,741,787
- Issue date Jun 3, 2014
- GLOBALFOUNDRIES Inc.
- Ulrich Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased stability of a complex material stack in a semiconductor...
- Patent number 8,609,555
- Issue date Dec 17, 2013
- GLOBALFOUNDRIES Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a semiconductor IC having a hardened shallow...
- Patent number 8,569,143
- Issue date Oct 29, 2013
- GLOBALFOUNDRIES, INC.
- Thorsten Kammler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cap layer with enhanced etch resistivity for copper-based met...
- Patent number 8,432,035
- Issue date Apr 30, 2013
- GLOBALFOUNDRIES Inc.
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing reliability of copper-based metallization structures in...
- Patent number 8,384,217
- Issue date Feb 26, 2013
- GLOBALFOUNDRIES Inc.
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Increasing reliability of copper-based metallization structures in...
- Patent number 8,222,135
- Issue date Jul 17, 2012
- GLOBALFOUNDRIES Inc.
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device comprising a copper alloy as a barrier layer i...
- Patent number 8,124,532
- Issue date Feb 28, 2012
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancing structural integrity and defining critical dimensions of...
- Patent number 8,105,943
- Issue date Jan 31, 2012
- GLOBALFOUNDRIES Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a metal cap layer with enhanced etch resistiv...
- Patent number 8,084,354
- Issue date Dec 27, 2011
- GLOBALFOUNDRIES Inc.
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufracturing increasing reliability of copper-based met...
- Patent number 7,829,460
- Issue date Nov 9, 2010
- GLOBALFOUNDRIES, Inc.
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique for forming nickel silicide by depositing nickel from a g...
- Patent number 7,687,398
- Issue date Mar 30, 2010
- Advanced Micro Devices, Inc.
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 7,638,428
- Issue date Dec 29, 2009
- GLOBALFOUNDRIES, INC.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a copper alloy as a barrier layer i...
- Patent number 7,595,269
- Issue date Sep 29, 2009
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for strain engineering in Si-based Transistors by using e...
- Patent number 7,544,551
- Issue date Jun 9, 2009
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a self-aligned nitrogen-containing copper silici...
- Patent number 7,413,985
- Issue date Aug 19, 2008
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for reducing silicide defects by reducing deleterious eff...
- Patent number 7,384,877
- Issue date Jun 10, 2008
- Advanced Micro Devices, Inc.
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an epitaxial layer for raised drain and source re...
- Patent number 7,307,026
- Issue date Dec 11, 2007
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k dielectric layer stack including an etch indicator layer for...
- Patent number 6,927,161
- Issue date Aug 9, 2005
- Advanced Micro Devices, Inc.
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a polysilicon line structure with incre...
- Patent number 6,746,927
- Issue date Jun 8, 2004
- Advanced Micro Devices, Inc.
- Thorsten Kammler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUITS WITH AN INSULTATING LAYER AND METHODS FOR PRODU...
- Publication number 20160013050
- Publication date Jan 14, 2016
- GLOBAL FOUNDRIES, INC.
- Ronny Pfutzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING A SEMICONDUCTOR IC HAVING A HARDENED SHALLOW...
- Publication number 20120329239
- Publication date Dec 27, 2012
- GLOBALFOUNDRIES Inc.
- Thorsten Kammler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing reliability of copper-based metallization structures in...
- Publication number 20120241958
- Publication date Sep 27, 2012
- GLOBALFOUNDRIES, INC.
- CHRISTOF STRECK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...
- Publication number 20120061839
- Publication date Mar 15, 2012
- GLOBALFOUNDRIES INC.
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increased Stability of a Complex Material Stack in a Semiconductor...
- Publication number 20120025392
- Publication date Feb 2, 2012
- GLOBALFOUNDRIES INC.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED DENSITY OF LOW-K DIELECTRIC MATERIALS IN SEMICONDUCTOR DE...
- Publication number 20110027989
- Publication date Feb 3, 2011
- Ulrich MAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Increasing reliability of copper-based metallization structures in...
- Publication number 20110018134
- Publication date Jan 27, 2011
- GLOBALFOUNDRIES,Inc.
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...
- Publication number 20100078821
- Publication date Apr 1, 2010
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING STRUCTURAL INTEGRITY AND DEFINING CRITICAL DIMENSIONS OF...
- Publication number 20100025855
- Publication date Feb 4, 2010
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER I...
- Publication number 20090305498
- Publication date Dec 10, 2009
- Advanced Micro Devices, Inc.
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR HAVING AN INTERLAYER DIELECTRIC MATERIAL HA...
- Publication number 20080203487
- Publication date Aug 28, 2008
- Joerg Hohage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN...
- Publication number 20080179741
- Publication date Jul 31, 2008
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20080128912
- Publication date Jun 5, 2008
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SELF-ALIGNED NITROGEN-CONTAINING COPPER SILICI...
- Publication number 20080132064
- Publication date Jun 5, 2008
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A POROUS LOW-K MATERIAL LAYER STACK...
- Publication number 20080099918
- Publication date May 1, 2008
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER...
- Publication number 20070123043
- Publication date May 31, 2007
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR STRAIN ENGINEERING IN SI-BASED TRANSISTORS BY USING E...
- Publication number 20070096194
- Publication date May 3, 2007
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR REDUCING SILICIDE DEFECTS BY REDUCING DELETERIOUS EFF...
- Publication number 20070045226
- Publication date Mar 1, 2007
- Volker Kahlert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR FORMING NICKEL SILICIDE BY DEPOSITING NICKEL FROM A G...
- Publication number 20070004203
- Publication date Jan 4, 2007
- Christof Streck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device including a low-k metallization layer stack fo...
- Publication number 20060043588
- Publication date Mar 2, 2006
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for forming a dielectric interlayer above a structure inc...
- Publication number 20060001168
- Publication date Jan 5, 2006
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an epitaxial layer for raised drain and source re...
- Publication number 20050026367
- Publication date Feb 3, 2005
- Christof Streck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technique for reducing resist poisoning in forming a metallization...
- Publication number 20040121265
- Publication date Jun 24, 2004
- Thomas Werner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Low-k dielectric layer stack including an etch indicator layer for...
- Publication number 20040041239
- Publication date Mar 4, 2004
- Hartmut Ruelke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a polysilicon line structure with incre...
- Publication number 20040043594
- Publication date Mar 4, 2004
- Thorsten Kammler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Highly efficient remote clean process for process chambers in depos...
- Publication number 20030200984
- Publication date Oct 30, 2003
- Christof Streck
- B08 - CLEANING

Christof Streck

Person

Patents Grantslast 30 patents

Integrated circuits with an insultating layer and methods for produ...

Technique for forming a dielectric interlayer above a structure inc...

Increased density of low-K dielectric materials in semiconductor de...

Increased stability of a complex material stack in a semiconductor...

Methods of fabricating a semiconductor IC having a hardened shallow...

Metal cap layer with enhanced etch resistivity for copper-based met...

Increasing reliability of copper-based metallization structures in...

Increasing reliability of copper-based metallization structures in...

Semiconductor device comprising a copper alloy as a barrier layer i...

Enhancing structural integrity and defining critical dimensions of...

Method of fabricating a metal cap layer with enhanced etch resistiv...

Method of manufracturing increasing reliability of copper-based met...

Technique for forming nickel silicide by depositing nickel from a g...

Semiconductor structure and method of forming the same

Semiconductor device comprising a copper alloy as a barrier layer i...

Technique for strain engineering in Si-based Transistors by using e...

Method for forming a self-aligned nitrogen-containing copper silici...

Technique for reducing silicide defects by reducing deleterious eff...

Method of forming an epitaxial layer for raised drain and source re...

Low-k dielectric layer stack including an etch indicator layer for...

Semiconductor device having a polysilicon line structure with incre...

Patents Applicationslast 30 patents

INTEGRATED CIRCUITS WITH AN INSULTATING LAYER AND METHODS FOR PRODU...

METHODS OF FABRICATING A SEMICONDUCTOR IC HAVING A HARDENED SHALLOW...

Increasing reliability of copper-based metallization structures in...

METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...

Increased Stability of a Complex Material Stack in a Semiconductor...

INCREASED DENSITY OF LOW-K DIELECTRIC MATERIALS IN SEMICONDUCTOR DE...

Increasing reliability of copper-based metallization structures in...

METAL CAP LAYER WITH ENHANCED ETCH RESISTIVITY FOR COPPER-BASED MET...

ENHANCING STRUCTURAL INTEGRITY AND DEFINING CRITICAL DIMENSIONS OF...

SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER I...

FIELD EFFECT TRANSISTOR HAVING AN INTERLAYER DIELECTRIC MATERIAL HA...

INCREASING RELIABILITY OF COPPER-BASED METALLIZATION STRUCTURES IN...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR FORMING A SELF-ALIGNED NITROGEN-CONTAINING COPPER SILICI...

SEMICONDUCTOR DEVICE INCLUDING A POROUS LOW-K MATERIAL LAYER STACK...

A SEMICONDUCTOR DEVICE COMPRISING A COPPER ALLOY AS A BARRIER LAYER...

TECHNIQUE FOR STRAIN ENGINEERING IN SI-BASED TRANSISTORS BY USING E...

TECHNIQUE FOR REDUCING SILICIDE DEFECTS BY REDUCING DELETERIOUS EFF...

TECHNIQUE FOR FORMING NICKEL SILICIDE BY DEPOSITING NICKEL FROM A G...

Semiconductor device including a low-k metallization layer stack fo...

Technique for forming a dielectric interlayer above a structure inc...

Method of forming an epitaxial layer for raised drain and source re...

Technique for reducing resist poisoning in forming a metallization...

Low-k dielectric layer stack including an etch indicator layer for...

Semiconductor device having a polysilicon line structure with incre...

Highly efficient remote clean process for process chambers in depos...