Christoph Flötgen

Person

Pramerdorf, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for bonding substrates
- Patent number 11,139,170
- Issue date Oct 5, 2021
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for plasma treatment of substrates
- Patent number 10,707,059
- Issue date Jul 7, 2020
- EV Group E. Thallner GmbH
- Thomas Glinsner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding substrates
- Patent number 10,438,798
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bonding substrates including changing a st...
- Patent number 9,899,223
- Issue date Feb 20, 2018
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 9,252,042
- Issue date Feb 2, 2016
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 9,159,717
- Issue date Oct 13, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanently bonding wafers
- Patent number 8,975,158
- Issue date Mar 10, 2015
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20190371607
- Publication date Dec 5, 2019
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20180130658
- Publication date May 10, 2018
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PLASMA TREATMENT OF SUBSTRATES
- Publication number 20170047203
- Publication date Feb 16, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Glinsner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20160225625
- Publication date Aug 4, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS
- Publication number 20150165752
- Publication date Jun 18, 2015
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140073112
- Publication date Mar 13, 2014
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140051231
- Publication date Feb 20, 2014
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20140017877
- Publication date Jan 16, 2014
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20130299080
- Publication date Nov 14, 2013
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Christoph Flötgen

Person

Patents Grantslast 30 patents

Apparatus and method for bonding substrates

Method for permanently bonding wafers

Method and device for plasma treatment of substrates

Apparatus and method for bonding substrates

Method for permanent bonding of wafers

Apparatus and method for bonding substrates including changing a st...

Method for permanent bonding of wafers

Method for permanently bonding wafers

Method for permanently bonding wafers

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR BONDING SUBSTRATES

METHOD FOR PERMANENT BONDING OF WAFERS

APPARATUS AND METHOD FOR BONDING SUBSTRATES

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD AND DEVICE FOR PLASMA TREATMENT OF SUBSTRATES

APPARATUS AND METHOD FOR BONDING SUBSTRATES

METHOD FOR PERMANENT BONDING OF WAFERS

METHOD AND DEVICE FOR PERMANENT BONDING OF WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENTLY BONDING WAFERS

METHOD FOR PERMANENT BONDING OF WAFERS