Christophe Maleville

Person

Lumbin, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a composite structure comprising a thin layer...
- Patent number 12,198,983
- Issue date Jan 14, 2025
- Soitec
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a substrate for a front-facing image sensor
- Patent number 12,100,727
- Issue date Sep 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a high-resistivity semiconductor-on-insula...
- Patent number 10,002,882
- Issue date Jun 19, 2018
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for radiofrequency applications and process for manufactu...
- Patent number 9,824,915
- Issue date Nov 21, 2017
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,818,874
- Issue date Nov 14, 2017
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor layers including transistor ch...
- Patent number 9,576,798
- Issue date Feb 21, 2017
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,349,865
- Issue date May 24, 2016
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including fin struc...
- Patent number 9,219,150
- Issue date Dec 22, 2015
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor layers including transistor ch...
- Patent number 9,209,301
- Issue date Dec 8, 2015
- Soitec
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the transfer of a thin film comprising an inclusion cre...
- Patent number 8,609,514
- Issue date Dec 17, 2013
- Commissariat a l'Energie Atomique
- Hubert Moriceau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the transfer of a thin film comprising an inclusion cre...
- Patent number 8,470,712
- Issue date Jun 25, 2013
- Commissariat a l'Energie Atomique
- Hubert Moriceau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating a semiconductor on insulator type substrate
- Patent number 8,216,917
- Issue date Jul 10, 2012
- Soitec
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor substrate
- Patent number 8,058,149
- Issue date Nov 15, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer method with a treatment of a surface to be bonded
- Patent number 7,972,939
- Issue date Jul 5, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of increasing the area of a useful layer of material transfe...
- Patent number 7,956,441
- Issue date Jun 7, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for preparing a bonding surface of a semiconductor wafer
- Patent number 7,919,391
- Issue date Apr 5, 2011
- S.O.I. Tec Silicon on Insulator Technologies
- Cécile Delattre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the transfer of a thin film
- Patent number 7,883,994
- Issue date Feb 8, 2011
- Commissariat a l'Energie Atomique
- Hubert Moriceau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for detecting surface defects on a substrate and device usin...
- Patent number 7,812,942
- Issue date Oct 12, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Cécile Moulin
- G01 - MEASURING TESTING
Information Patent Grant
Edge removal of silicon-on-insulator transfer wafer
- Patent number 7,749,908
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing the surface roughness of a semiconductor wafer
- Patent number 7,749,910
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Eric Neyret
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for minimizing defects when transferring a semiconductor us...
- Patent number 7,749,862
- Issue date Jul 6, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing a bonding surface of a semiconductor wafer
- Patent number 7,645,392
- Issue date Jan 12, 2010
- S.O.I. Tec Silicon on Insulator Technologies
- Corinne Maunand Tussot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer method with a treatment of a surface to be bonded
- Patent number 7,615,464
- Issue date Nov 10, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a high temperature heat treatment to a semicond...
- Patent number 7,585,793
- Issue date Sep 8, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for high-temperature annealing a multilayer wafer
- Patent number 7,544,058
- Issue date Jun 9, 2009
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detaching a layer from a wafer using a localized starting...
- Patent number 7,465,645
- Issue date Dec 16, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of increasing the area of a useful layer of material transfe...
- Patent number 7,452,584
- Issue date Nov 18, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of revealing crystalline defects in a bulk substrate
- Patent number 7,413,964
- Issue date Aug 19, 2008
- S.O.I. Tec Silicon on Insulator Technologies
- Patrick Reynaud
- G01 - MEASURING TESTING
Information Patent Grant
Process for detaching layers of material
- Patent number 7,300,856
- Issue date Nov 27, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing thin layers of semiconductor material from a d...
- Patent number 7,297,611
- Issue date Nov 20, 2007
- S.O.I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20250015122
- Publication date Jan 9, 2025
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...
- Publication number 20250004196
- Publication date Jan 2, 2025
- SOITEC
- Ionut Radu
- G02 - OPTICS
Information Patent Application
COMPOSITE STRUCTURE COMPRISING A USEFUL MONOCRYSTALLINE SIC LAYER O...
- Publication number 20240395603
- Publication date Nov 28, 2024
- SOITEC
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SILICON CARBIDE-BASED SEMICONDUCTOR STRUCTUR...
- Publication number 20240170284
- Publication date May 23, 2024
- SOITEC
- Gweltaz Gaudin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUPPORT SUBSTRATE MADE OF SILICON SUITABLE FOR RADIOFREQUENCY APPLI...
- Publication number 20240071755
- Publication date Feb 29, 2024
- SOITEC
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
- Publication number 20230260841
- Publication date Aug 17, 2023
- SOITEC
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A SeOI INTEGRATED CIRCUIT CHIP
- Publication number 20230170264
- Publication date Jun 1, 2023
- SOITEC
- Trong Hyunh-Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES
- Publication number 20220399441
- Publication date Dec 15, 2022
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR
- Publication number 20220059603
- Publication date Feb 24, 2022
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR RADIOFREQUENCY APPLICATIONS AND PROCESS FOR MANUFACTU...
- Publication number 20170084478
- Publication date Mar 23, 2017
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A HIGH-RESISTIVITY SEMICONDUCTOR-ON-INSULA...
- Publication number 20160372484
- Publication date Dec 22, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...
- Publication number 20160268430
- Publication date Sep 15, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...
- Publication number 20160087100
- Publication date Mar 24, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR LAYERS INCLUDING TRANSISTOR CH...
- Publication number 20160086803
- Publication date Mar 24, 2016
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING SURFACE ROUGHNESS WHILE PRODUCING A HIGH QUALIT...
- Publication number 20150221545
- Publication date Aug 6, 2015
- SOITEC
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE TRANSFER OF A THIN FILM COMPRISING AN INCLUSION CRE...
- Publication number 20130273713
- Publication date Oct 17, 2013
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE TRANSFER OF A THIN FILM COMPRISING AN INCLUSION CRE...
- Publication number 20110092051
- Publication date Apr 21, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE
- Publication number 20110034006
- Publication date Feb 10, 2011
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR ON INSULATOR TYPE SUBSTRATE
- Publication number 20100297828
- Publication date Nov 25, 2010
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER METHOD WITH A TREATMENT OF A SURFACE TO BE BONDED
- Publication number 20100015780
- Publication date Jan 21, 2010
- S.O.I.Tec Silicon on Insulator Technologies
- Sébastien KERDILES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Removal Of Silicon-On-Insulator Transfer Wafer
- Publication number 20090061545
- Publication date Mar 5, 2009
- Applied Materials, Inc.
- Raymond John Donohoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INCREASING THE AREA OF A USEFUL LAYER OF MATERIAL TRANSFE...
- Publication number 20080006909
- Publication date Jan 10, 2008
- S. O. I. Tec Silicon on Insulator Technologies
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of revealing crystalline defects in a bulk substrate
- Publication number 20070231932
- Publication date Oct 4, 2007
- Patrick Reynaud
- C30 - CRYSTAL GROWTH
Information Patent Application
PROCESS FOR THE TRANSFER OF A THIN FILM
- Publication number 20070232025
- Publication date Oct 4, 2007
- COMMISSARIAT A L'ENERGIE ATOMIQUE
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...
- Publication number 20070117229
- Publication date May 24, 2007
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for applying a high temperature heat treatment to a semicond...
- Publication number 20070026692
- Publication date Feb 1, 2007
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for preparing a bonding surface of a semiconductor wafer
- Publication number 20060273068
- Publication date Dec 7, 2006
- COMMISSARIAT A L'ENERGIE ATOMIQUE (CEA)
- Corinne Maunand Tussot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer method with a treatment of a surface to be bonded
- Publication number 20060270187
- Publication date Nov 30, 2006
- Sébastien Kerdiles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a high quality useful layer on a substrate
- Publication number 20060223283
- Publication date Oct 5, 2006
- Christophe Maleville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for transfer of a thin layer formed in a substrate with vac...
- Publication number 20060172508
- Publication date Aug 3, 2006
- Christophe Maleville
- C30 - CRYSTAL GROWTH

Christophe Maleville

Person

Patents Grantslast 30 patents

Method for producing a composite structure comprising a thin layer...

Method for manufacturing a substrate for a front-facing image sensor

Method for manufacturing a high-resistivity semiconductor-on-insula...

Structure for radiofrequency applications and process for manufactu...

Method for fabricating semiconductor structures including fin struc...

Method for fabricating semiconductor layers including transistor ch...

Method for fabricating semiconductor structures including fin struc...

Method for fabricating semiconductor structures including fin struc...

Method for fabricating semiconductor layers including transistor ch...

Process for the transfer of a thin film comprising an inclusion cre...

Process for the transfer of a thin film comprising an inclusion cre...

Method for fabricating a semiconductor on insulator type substrate

Method for fabricating a semiconductor substrate

Transfer method with a treatment of a surface to be bonded

Method of increasing the area of a useful layer of material transfe...

Methods for preparing a bonding surface of a semiconductor wafer

Process for the transfer of a thin film

Method for detecting surface defects on a substrate and device usin...

Edge removal of silicon-on-insulator transfer wafer

Method of reducing the surface roughness of a semiconductor wafer

Methods for minimizing defects when transferring a semiconductor us...

Methods for preparing a bonding surface of a semiconductor wafer

Transfer method with a treatment of a surface to be bonded

Method for applying a high temperature heat treatment to a semicond...

Method for high-temperature annealing a multilayer wafer

Method of detaching a layer from a wafer using a localized starting...

Method of increasing the area of a useful layer of material transfe...

Method of revealing crystalline defects in a bulk substrate

Process for detaching layers of material

Method for producing thin layers of semiconductor material from a d...

Patents Applicationslast 30 patents

STRUCTURE FOR A FRONT-FACING IMAGE SENSOR

PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...

COMPOSITE STRUCTURE COMPRISING A USEFUL MONOCRYSTALLINE SIC LAYER O...

METHOD FOR PRODUCING A SILICON CARBIDE-BASED SEMICONDUCTOR STRUCTUR...

SUPPORT SUBSTRATE MADE OF SILICON SUITABLE FOR RADIOFREQUENCY APPLI...

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...

METHOD FOR MANUFACTURING A SeOI INTEGRATED CIRCUIT CHIP

DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES

METHOD FOR MANUFACTURING A SUBSTRATE FOR A FRONT-FACING IMAGE SENSOR

STRUCTURE FOR RADIOFREQUENCY APPLICATIONS AND PROCESS FOR MANUFACTU...

METHOD FOR MANUFACTURING A HIGH-RESISTIVITY SEMICONDUCTOR-ON-INSULA...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING FIN STRUC...

METHOD FOR FABRICATING SEMICONDUCTOR LAYERS INCLUDING TRANSISTOR CH...

METHOD FOR REDUCING SURFACE ROUGHNESS WHILE PRODUCING A HIGH QUALIT...

PROCESS FOR THE TRANSFER OF A THIN FILM COMPRISING AN INCLUSION CRE...

PROCESS FOR THE TRANSFER OF A THIN FILM COMPRISING AN INCLUSION CRE...

METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE

METHOD FOR FABRICATING A SEMICONDUCTOR ON INSULATOR TYPE SUBSTRATE

TRANSFER METHOD WITH A TREATMENT OF A SURFACE TO BE BONDED

Edge Removal Of Silicon-On-Insulator Transfer Wafer

METHOD OF INCREASING THE AREA OF A USEFUL LAYER OF MATERIAL TRANSFE...

Method of revealing crystalline defects in a bulk substrate

PROCESS FOR THE TRANSFER OF A THIN FILM

METHODS FOR MINIMIZING DEFECTS WHEN TRANSFERRING A SEMICONDUCTOR US...

Method for applying a high temperature heat treatment to a semicond...

Methods for preparing a bonding surface of a semiconductor wafer

Transfer method with a treatment of a surface to be bonded

Method for producing a high quality useful layer on a substrate

Process for transfer of a thin layer formed in a substrate with vac...