CHRISTOPHER APANIUS

Person

MORELAND HILLS, OH, US

People

Patents Grantslast 30 patents

Information Patent Grant
Polymer composition for microelectronic assembly
- Patent number 9,765,200
- Issue date Sep 19, 2017
- Promerus, LLC
- Christopher Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-oxidatively stable, side chain polyether functionalized poly...
- Patent number 9,562,124
- Issue date Feb 7, 2017
- Promerus, LLC
- Christopher Apanius
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Thermo-oxidatively stable, side chain polyether functionalized poly...
- Patent number 9,425,404
- Issue date Aug 23, 2016
- Promerus, LLC
- Christopher Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 9,263,416
- Issue date Feb 16, 2016
- Sumitomo Bakelite Co., Ltd.
- Christopher Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 8,816,485
- Issue date Aug 26, 2014
- Sumitomo Bakelite Co., Ltd.
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer composition for microelectronic assembly
- Patent number 8,729,166
- Issue date May 20, 2014
- Promerus, LLC
- Christopher Apanius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer composition for microelectronic assembly
- Patent number 8,575,248
- Issue date Nov 5, 2013
- Promerus, LLC
- Christopher Apanius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer composition for microelectronic assembly
- Patent number 8,535,454
- Issue date Sep 17, 2013
- Promerus, LLC
- Christopher Apanius
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 8,120,168
- Issue date Feb 21, 2012
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive compositions based on polycyclic polymers for low st...
- Patent number 8,030,425
- Issue date Oct 4, 2011
- Promerus LLC
- Christopher Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Methods and materials useful for chip stacking, chip and wafer bonding
- Patent number 7,932,161
- Issue date Apr 26, 2011
- Promerus LLC
- Chris Apanius
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Micro mirror arrays and microstructures with solderable connection...
- Patent number 7,203,394
- Issue date Apr 10, 2007
- Rosemount Aerospace Inc.
- Thomas Wiegele
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
COATED SUBSTRATES AND METHODS OF PREPARING THE SAME
- Publication number 20230167311
- Publication date Jun 1, 2023
- PPG INDUSTRIES OHIO, INC.
- Brian E. Woodworth
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TWO-LAYER DIELECTRIC COATING
- Publication number 20230143426
- Publication date May 11, 2023
- PPG INDUSTRIES OHIO, INC.
- Sijmen J. Visser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING POWDER COATING COM...
- Publication number 20230115050
- Publication date Apr 13, 2023
- PPG INDUSTRIES OHIO, INC.
- Liang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-oxidatively Stable, Side Chain Polyether Functionalized Poly...
- Publication number 20160319060
- Publication date Nov 3, 2016
- PROMERUS, LLC
- CHRISTOPHER APANIUS
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
- Publication number 20140349446
- Publication date Nov 27, 2014
- PROMERUS, LLC
- CHRISTOPHER APANIUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composition for Microelectronic Assembly
- Publication number 20140024750
- Publication date Jan 23, 2014
- PROMERUS, LLC
- Christopher Apanius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer Composition for Microelectronic Assembly
- Publication number 20130327815
- Publication date Dec 12, 2013
- Promerus, LLC
- Christopher Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-oxidatively Stable, Side Chain Polyether Functionalized Poly...
- Publication number 20130181199
- Publication date Jul 18, 2013
- SUMITOMO BAKELITE CO., LTD.
- Christopher Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composition for Microelectronic Assembly
- Publication number 20120298729
- Publication date Nov 29, 2012
- Promerus LLC
- Christopher Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding
- Publication number 20120175721
- Publication date Jul 12, 2012
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Composition for Microelectronic Assembly
- Publication number 20120034387
- Publication date Feb 9, 2012
- Promerus LLC
- Christopher Apanius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW ST...
- Publication number 20090189277
- Publication date Jul 30, 2009
- Promerus LLC
- Christopher Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Methods and materials useful for chip stacking, chip and wafer bonding
- Publication number 20080073741
- Publication date Mar 27, 2008
- Promerus LLC
- Chris Apanius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and materials useful for chip stacking, chip and wafer bonding
- Publication number 20070232026
- Publication date Oct 4, 2007
- Promerus LLC
- Chris Apanius
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Photosensitive compositions based on polycyclic polymers for low st...
- Publication number 20060020068
- Publication date Jan 26, 2006
- Edmund Elce
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Micro mirror arrays and microstructures with solderable connection...
- Publication number 20050013533
- Publication date Jan 20, 2005
- Thomas Wiegele
- B81 - MICRO-STRUCTURAL TECHNOLOGY

CHRISTOPHER APANIUS

Person

Patents Grantslast 30 patents

Polymer composition for microelectronic assembly

Thermo-oxidatively stable, side chain polyether functionalized poly...

Thermo-oxidatively stable, side chain polyether functionalized poly...

Methods and materials useful for chip stacking, chip and wafer bonding

Methods and materials useful for chip stacking, chip and wafer bonding

Polymer composition for microelectronic assembly

Polymer composition for microelectronic assembly

Polymer composition for microelectronic assembly

Methods and materials useful for chip stacking, chip and wafer bonding

Photosensitive compositions based on polycyclic polymers for low st...

Methods and materials useful for chip stacking, chip and wafer bonding

Micro mirror arrays and microstructures with solderable connection...

Patents Applicationslast 30 patents

COATED SUBSTRATES AND METHODS OF PREPARING THE SAME

TWO-LAYER DIELECTRIC COATING

THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING POWDER COATING COM...

Thermo-oxidatively Stable, Side Chain Polyether Functionalized Poly...

METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING

Polymer Composition for Microelectronic Assembly

Polymer Composition for Microelectronic Assembly

Thermo-oxidatively Stable, Side Chain Polyether Functionalized Poly...

Polymer Composition for Microelectronic Assembly

Methods And Materials Useful For Chip Stacking, Chip And Wafer Bonding

Polymer Composition for Microelectronic Assembly

PHOTOSENSITIVE COMPOSITIONS BASED ON POLYCYCLIC POLYMERS FOR LOW ST...

Methods and materials useful for chip stacking, chip and wafer bonding

Methods and materials useful for chip stacking, chip and wafer bonding

Photosensitive compositions based on polycyclic polymers for low st...

Micro mirror arrays and microstructures with solderable connection...