Christopher C. Jones

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic package substrate with recessed device
- Patent number 8,264,846
- Issue date Sep 11, 2012
- Intel Corporation
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC PACKAGE SUBSTRATE WITH RECESSED DEVICE
- Publication number 20080142961
- Publication date Jun 19, 2008
- Christopher C. Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR